Electromigration analysis of solder joints under ac load: A mean time to failure model

In this study, alternating current (ac) electromigration (EM) degradation simulations were carried out for Sn95.5%Ag4.0%Cu0.5 (SAC405- by weight) solder joints. Mass transport analysis was conducted with viscoplastic material properties for quantifying damage mechanism in solder joints. Square, sine, and triangle current wave forms ac were used as input signals. dc and pulsed dc (PDC) electromigration analysis were conducted for comparison purposes. The maximum current density ranged from 2.2×106A/cm2 to 5.0×106A/cm2, frequency ranged from 0.05 Hz to 5 Hz with ambient temperature varying from 350 K to 450 K. Because the room temperature is nearly two-thirds of SAC solder joint’s melting point on absolute temperature scale (494.15 K), viscoplastic material model is essential. Entropy based damage evolution model was used to investigate mean time to failure (MTF) behavior of solder joints subjected to ac stressing. It was observed that MTF was inversely proportional to ambient temperature T1.1 in Celsius an...

[1]  Tu.  Electromigration in stressed thin films. , 1992, Physical review. B, Condensed matter.

[2]  Chenming Hu.  Reliability phenomena under AC stress , 1998 .

[3]  Cemal Basaran,et al.  Measurement of high electrical current density effects in solder joints , 2003, Microelectron. Reliab..

[4]  Cemal Basaran,et al.  A computational damage mechanics model for thermomigration , 2009 .

[5]  R. Balzer,et al.  Equilibrium vacancy concentration measurements on tin single crystals , 1979 .

[6]  D. Kofke,et al.  Lattice Strain Due to an Atomic Vacancy , 2009, International journal of molecular sciences.

[7]  Dallas N. Little,et al.  A continuum damage mechanics framework for modeling micro-damage healing , 2012 .

[8]  C. Basaran,et al.  Deformation of solder joint under current stressing and numerical simulation--II , 2004 .

[9]  C. Basaran,et al.  Semi-classical transport for predicting joule heating in carbon nanotubes , 2010 .

[10]  Chih Chen,et al.  Study of electromigration in eutectic SnPb solder stripes using the edge displacement method , 2006 .

[11]  King-Ning Tu,et al.  Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration , 2006 .

[12]  C. Basaran,et al.  Low temperature electromigration and thermomigration in lead-free solder joints , 2008, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).

[13]  D. Frear,et al.  Damage mechanics of microelectronics solder joints under high current densities , 2003, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[14]  Jiang Tao,et al.  Electromigration under time-varying current stress , 1998 .

[15]  Hua Ye,et al.  Mechanical degradation of microelectronics solder joints under current stressing , 2003 .

[16]  Hua Ye,et al.  Mechanical Implications of High Current Densities in Flip-chip Solder Joints , 2004 .

[17]  Minghui Lin,et al.  Damage mechanics of electromigration in microelectronics copper interconnects , 2007 .

[18]  M. Korhonen,et al.  Stress evolution due to electromigration in confined metal lines , 1993 .

[19]  E. Kinsbron,et al.  Electromigration in thin gold films on molybdenum surfaces , 1975 .

[20]  D. Kofke,et al.  Solute Effects on β-Sn Grain Boundary Energy and Shear Stress , 2011 .

[21]  Chenming Hu,et al.  Projecting interconnect electromigration lifetime for arbitrary current waveforms , 1990 .

[22]  Cemal Basaran,et al.  Simulating Damage Mechanics of Electromigration and Thermomigration , 2008, Simul..

[23]  F. Shi,et al.  Stochastic simulation of electromigration failure of flip chip solder bumps , 2001 .

[24]  Cemal Basaran,et al.  Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties , 2009 .

[25]  Jiang Tao,et al.  Electromigration design rules for bidirectional current , 1996, Proceedings of International Reliability Physics Symposium.

[26]  J. Black.  Electromigration failure modes in aluminum metallization for semiconductor devices , 1969 .

[27]  I. Blech.  Electromigration in thin aluminum films on titanium nitride , 1976 .

[28]  Cemal Basaran,et al.  Thermomigration in lead-free solder joints , 2008 .

[29]  Hua Ye,et al.  Failure Modes of Flip Chip Solder Joints Under High Electric Current Density , 2005 .

[30]  K. Tu.  Recent advances on electromigration in very-large-scale-integration of interconnects , 2003 .

[31]  R. Miller,et al.  Electromigration Failure Under Pulse Test Conditions , 1978, 16th International Reliability Physics Symposium.

[32]  Cemal Basaran,et al.  A Thermodynamic Framework for Damage Mechanics of Solder Joints , 1998 .

[33]  C. S. Lin,et al.  Study of DC and AC Electromigration Behavior in Eutectic Pb-Sn Solder Joints , 2009 .

[34]  C. Basaran,et al.  An Irreversible Thermodynamics Theory for Damage Mechanics of Solids , 2004 .

[35]  Minghui Lin,et al.  Electromigration induced stress analysis using fully coupled mechanical-diffusion equations with nonlinear material properties , 2005 .

[36]  C. Basaran,et al.  Damage mechanics of electromigration induced failure , 2008 .

[37]  Cemal Basaran,et al.  Thermomigration induced degradation in solder alloys , 2008 .

[38]  K. Tu.  Recent advances on electromigration in very-large-scale-integration of interconnects , 2003 .

[39]  C. Basaran,et al.  Damage Mechanics of Low Temperature Electromigration and Thermomigration , 2009, IEEE Transactions on Advanced Packaging.

[40]  C. Basaran,et al.  The prediction of the effective charge number in single-walled carbon nanotubes using Monte Carlo simulation , 2011 .

[41]  C. Basaran,et al.  Electromigration induced strain field simulations for nanoelectronics lead-free solder joints , 2007 .

[42]  Cemal Basaran,et al.  Electromigration time to failure of SnAgCuNi solder joints , 2009 .

[43]  C. Basaran,et al.  Measuring Joule heating and strain induced by electrical current with Moiré interferometry , 2011 .

[44]  Paul S. Ho,et al.  Electromigration reliability issues in dual-damascene Cu interconnections , 2002, IEEE Trans. Reliab..

[45]  T. M. Makhviladze,et al.  General model for mechanical stress evolution during electromigration , 1999 .

[46]  D. Kofke,et al.  Atomistic modeling of β-Sn surface energies and adatom diffusivity , 2010 .

[47]  Yi-Shao Lai,et al.  Thermomigration Versus Electromigration in Microelectronics Solder Joints , 2009, IEEE Transactions on Advanced Packaging.

[48]  Hua Ye,et al.  Numerical simulation of stress evolution during electromigration in IC interconnect lines , 2003 .

[49]  Hua Ye,et al.  Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing , 2004 .

[50]  King-Ning Tu,et al.  Solder Joint Technology: Materials, Properties, and Reliability , 2007 .

[51]  C. Basaran,et al.  Effective diffusivity of lead free solder alloys , 2009 .

[52]  Conyers Herring,et al.  Stress generation by electromigration , 1976 .

[53]  C. Basaran,et al.  Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses , 2006 .

[54]  Hua Ye,et al.  A thermodynamic model for electrical current induced damage , 2003, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[55]  Hua Ye,et al.  Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing , 2003 .

[56]  M. Ashby,et al.  Deformation-Mechanism Maps: The Plasticity and Creep of Metals and Ceramics , 1982 .

[57]  R. Vinci,et al.  Microstructural evolution in lead-free solder alloys: Part I. Cast Sn–Ag–Cu eutectic , 2004 .