Electromigration analysis of solder joints under ac load: A mean time to failure model
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Cemal Basaran | Wei Yao | C. Basaran | W. Yao
[1] Tu. Electromigration in stressed thin films. , 1992, Physical review. B, Condensed matter.
[2] Chenming Hu. Reliability phenomena under AC stress , 1998 .
[3] Cemal Basaran,et al. Measurement of high electrical current density effects in solder joints , 2003, Microelectron. Reliab..
[4] Cemal Basaran,et al. A computational damage mechanics model for thermomigration , 2009 .
[5] R. Balzer,et al. Equilibrium vacancy concentration measurements on tin single crystals , 1979 .
[6] D. Kofke,et al. Lattice Strain Due to an Atomic Vacancy , 2009, International journal of molecular sciences.
[7] Dallas N. Little,et al. A continuum damage mechanics framework for modeling micro-damage healing , 2012 .
[8] C. Basaran,et al. Deformation of solder joint under current stressing and numerical simulation--II , 2004 .
[9] C. Basaran,et al. Semi-classical transport for predicting joule heating in carbon nanotubes , 2010 .
[10] Chih Chen,et al. Study of electromigration in eutectic SnPb solder stripes using the edge displacement method , 2006 .
[11] King-Ning Tu,et al. Effect of three-dimensional current and temperature distributions on void formation and propagation in flip-chip solder joints during electromigration , 2006 .
[12] C. Basaran,et al. Low temperature electromigration and thermomigration in lead-free solder joints , 2008, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
[13] D. Frear,et al. Damage mechanics of microelectronics solder joints under high current densities , 2003, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[14] Jiang Tao,et al. Electromigration under time-varying current stress , 1998 .
[15] Hua Ye,et al. Mechanical degradation of microelectronics solder joints under current stressing , 2003 .
[16] Hua Ye,et al. Mechanical Implications of High Current Densities in Flip-chip Solder Joints , 2004 .
[17] Minghui Lin,et al. Damage mechanics of electromigration in microelectronics copper interconnects , 2007 .
[18] M. Korhonen,et al. Stress evolution due to electromigration in confined metal lines , 1993 .
[19] E. Kinsbron,et al. Electromigration in thin gold films on molybdenum surfaces , 1975 .
[20] D. Kofke,et al. Solute Effects on β-Sn Grain Boundary Energy and Shear Stress , 2011 .
[21] Chenming Hu,et al. Projecting interconnect electromigration lifetime for arbitrary current waveforms , 1990 .
[22] Cemal Basaran,et al. Simulating Damage Mechanics of Electromigration and Thermomigration , 2008, Simul..
[23] F. Shi,et al. Stochastic simulation of electromigration failure of flip chip solder bumps , 2001 .
[24] Cemal Basaran,et al. Influence of Thermomigration on Lead-Free Solder Joint Mechanical Properties , 2009 .
[25] Jiang Tao,et al. Electromigration design rules for bidirectional current , 1996, Proceedings of International Reliability Physics Symposium.
[26] J. Black. Electromigration failure modes in aluminum metallization for semiconductor devices , 1969 .
[27] I. Blech. Electromigration in thin aluminum films on titanium nitride , 1976 .
[28] Cemal Basaran,et al. Thermomigration in lead-free solder joints , 2008 .
[29] Hua Ye,et al. Failure Modes of Flip Chip Solder Joints Under High Electric Current Density , 2005 .
[30] K. Tu. Recent advances on electromigration in very-large-scale-integration of interconnects , 2003 .
[31] R. Miller,et al. Electromigration Failure Under Pulse Test Conditions , 1978, 16th International Reliability Physics Symposium.
[32] Cemal Basaran,et al. A Thermodynamic Framework for Damage Mechanics of Solder Joints , 1998 .
[33] C. S. Lin,et al. Study of DC and AC Electromigration Behavior in Eutectic Pb-Sn Solder Joints , 2009 .
[34] C. Basaran,et al. An Irreversible Thermodynamics Theory for Damage Mechanics of Solids , 2004 .
[35] Minghui Lin,et al. Electromigration induced stress analysis using fully coupled mechanical-diffusion equations with nonlinear material properties , 2005 .
[36] C. Basaran,et al. Damage mechanics of electromigration induced failure , 2008 .
[37] Cemal Basaran,et al. Thermomigration induced degradation in solder alloys , 2008 .
[38] K. Tu. Recent advances on electromigration in very-large-scale-integration of interconnects , 2003 .
[39] C. Basaran,et al. Damage Mechanics of Low Temperature Electromigration and Thermomigration , 2009, IEEE Transactions on Advanced Packaging.
[40] C. Basaran,et al. The prediction of the effective charge number in single-walled carbon nanotubes using Monte Carlo simulation , 2011 .
[41] C. Basaran,et al. Electromigration induced strain field simulations for nanoelectronics lead-free solder joints , 2007 .
[42] Cemal Basaran,et al. Electromigration time to failure of SnAgCuNi solder joints , 2009 .
[43] C. Basaran,et al. Measuring Joule heating and strain induced by electrical current with Moiré interferometry , 2011 .
[44] Paul S. Ho,et al. Electromigration reliability issues in dual-damascene Cu interconnections , 2002, IEEE Trans. Reliab..
[45] T. M. Makhviladze,et al. General model for mechanical stress evolution during electromigration , 1999 .
[46] D. Kofke,et al. Atomistic modeling of β-Sn surface energies and adatom diffusivity , 2010 .
[47] Yi-Shao Lai,et al. Thermomigration Versus Electromigration in Microelectronics Solder Joints , 2009, IEEE Transactions on Advanced Packaging.
[48] Hua Ye,et al. Numerical simulation of stress evolution during electromigration in IC interconnect lines , 2003 .
[49] Hua Ye,et al. Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing , 2004 .
[50] King-Ning Tu,et al. Solder Joint Technology: Materials, Properties, and Reliability , 2007 .
[51] C. Basaran,et al. Effective diffusivity of lead free solder alloys , 2009 .
[52] Conyers Herring,et al. Stress generation by electromigration , 1976 .
[53] C. Basaran,et al. Experimental Damage Mechanics of Micro/Power Electronics Solder Joints under Electric Current Stresses , 2006 .
[54] Hua Ye,et al. A thermodynamic model for electrical current induced damage , 2003, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[55] Hua Ye,et al. Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing , 2003 .
[56] M. Ashby,et al. Deformation-Mechanism Maps: The Plasticity and Creep of Metals and Ceramics , 1982 .
[57] R. Vinci,et al. Microstructural evolution in lead-free solder alloys: Part I. Cast Sn–Ag–Cu eutectic , 2004 .