Influence of network bond percolation on the thermal, mechanical, electrical and optical properties of high and low-k a-SiC:H thin films
暂无分享,去创建一个
Yusuke Matsuda | Lauren R. Olasov | Sean W. King | Donald B. Hondongwa | B. C. Daly | Gheorghe Stan | Guanghai Xu | Reinhold H. Dauskardt | William A. Lanford | Donald Hondongwa | David W. Gidley | R. Dauskardt | W. Lanford | G. Stan | J. Bielefeld | Ming Liu | S. King | D. Dutta | Ming Liu | Jeff Bielefeld | Namjun Kim | Lauren Olasov | Dhanadeep Dutta | D. Gidley | Y. Matsuda | Guanghai Xu | Namjun Kim | B. Daly
[1] W. Lanford,et al. Corrigendum to “Mass and bond density measurements for PECVD a-SiCx:H thin films using Fourier transform-infrared spectroscopy” [J. Non-Cryst. Solids 357 (2011) 3602–3615] , 2013 .
[2] Patrick M. Lenahan,et al. Defects and electronic transport in hydrogenated amorphous SiC films of interest for low dielectric constant back end of the line dielectric systems , 2013 .
[3] R. Dauskardt,et al. Tunable plasticity in amorphous silicon carbide films. , 2013, ACS applied materials & interfaces.
[4] R. Dauskardt,et al. Moisture-assisted cracking and atomistic crack path meandering in oxidized hydrogenated amorphous silicon carbide films , 2013 .
[5] Sean W. King,et al. Noncontact optical metrologies for Young’s modulus measurements of nanoporous low-k dielectric thin films , 2013 .
[6] Jenq-Yang Chang,et al. Crystalline silicon interface passivation improvement with a-Si1−xCx:H and its application in hetero-junction solar cells with intrinsic layer , 2012 .
[7] Dolores C. Miller,et al. Post Porosity Plasma Protection: Scaling of Efficiency with Porosity , 2012 .
[8] R. Dauskardt,et al. Moisture-insensitive polycarbosilane films with superior mechanical properties. , 2012, ACS applied materials & interfaces.
[9] A. D. Johnson,et al. Silicon precursor development for advanced dielectric barriers for VLSI technology , 2012 .
[10] David De Roest,et al. Influence of porosity on electrical properties of low-k dielectrics , 2012 .
[11] Jong Won Chung,et al. Liquid Crystals: Mesomorphic Organization and Thermochromic Luminescence of Dicyanodistyrylbenzene‐Based Phasmidic Molecular Disks: Uniaxially Aligned Hexagonal Columnar Liquid Crystals at Room Temperature with Enhanced Fluorescence Emission and Semiconductivity (Adv. Funct. Mater. 1/2012) , 2012 .
[12] Yusuke Matsuda,et al. Fracture properties of hydrogenated amorphous silicon carbide thin films , 2012 .
[13] Marc French,et al. Film Property Requirements for Hermetic Low-k a-SiOxCyNz:H Dielectric Barriers , 2012 .
[14] Sean W. King,et al. Mass and bond density measurements for PECVD a-SiCx:H thin films using Fourier transform-infrared spectroscopy , 2011 .
[15] Benjamin French,et al. X-ray photoelectron spectroscopy measurement of the Schottky barrier at the SiC(N)/Cu interface , 2011 .
[16] Lauren R. Olasov,et al. Thermal conductivity and sound velocity measurements of plasma enhanced chemical vapor deposited a-SiC:H thin films , 2011 .
[17] N. Marks,et al. Effect of microstructure on the thermal conductivity of disordered carbon , 2011 .
[18] W. Lanford,et al. Fourier transform infrared spectroscopy investigation of chemical bonding in low-k a-SiC:H thin films , 2011 .
[19] Kelin J. Kuhn. Moore's crystal ball: Device physics and technology past the 15nm generation , 2011 .
[20] Stephan A. Cohen,et al. A Manufacturing Grade, Porous Oxycarbosilane Spin-On Dielectric Candidate with K ≤ 2.0 , 2011 .
[21] Sean W. King,et al. Plasma enhanced atomic layer deposition of SiNx:H and SiO2 , 2011 .
[22] Ying-Lang Wang,et al. Comprehensive comparison of electrical and reliability characteristics of various copper barrier filmsa) , 2011 .
[23] Yi-Lung Cheng,et al. Comparative Study of Low Dielectric Constant Material Deposited Using Different Precursors , 2011 .
[24] E. Kaxiras,et al. Stiffening of organosilicate glasses by organic cross-linking , 2011 .
[25] Marc G. Ghossoub,et al. Percolation of thermal conductivity in amorphous fluorocarbons , 2010 .
[26] Sean W. King,et al. Rigidity Percolation in Plasma Enhanced Chemical Vapor Deposited a-SiC:H Thin Films , 2010 .
[27] M. Smedskjaer,et al. Prediction of glass hardness using temperature-dependent constraint theory. , 2010, Physical review letters.
[28] John C. Mauro,et al. Quantitative Design of Glassy Materials Using Temperature-Dependent Constraint Theory , 2010 .
[29] S. King,et al. Intrinsic stress effect on fracture toughness of plasma enhanced chemical vapor deposited SiNx:H films , 2010 .
[30] K. Gleason,et al. Ultralow Dielectric Constant Tetravinyltetramethylcyclotetrasiloxane Films Deposited by Initiated Chemical Vapor Deposition (iCVD) , 2010 .
[31] Willi Volksen,et al. Low dielectric constant materials. , 2010, Chemical reviews.
[32] R. Cook,et al. Elastic modulus of low-k dielectric thin films measured by load-dependent contact-resonance atomic force microscopy , 2009 .
[33] Sean W. King,et al. Intrinsic stress fracture energy measurements for PECVD thin films in the SiOxCyNz: H system , 2009, Microelectron. Reliab..
[34] J. Mauro,et al. Composition dependence of glass transition temperature and fragility. II. A topological model of alkali borate liquids. , 2009, The Journal of chemical physics.
[35] Barry Luther-Davies,et al. Observation of two elastic thresholds in GexAsyse1-x-y glasses , 2009 .
[36] J. Mauro,et al. Composition dependence of glass transition temperature and fragility. I. A topological model incorporating temperature-dependent constraints. , 2009, The Journal of chemical physics.
[37] Gaddi S. Haase. A model for electric degradation of interconnect low-k dielectrics in microelectronic integrated circuits , 2009 .
[38] Mostafa M. Abdalla,et al. Celebrating the 100th anniversary of the Stoney equation for film stress: Developments from polycrystalline steel strips to single crystal silicon wafers , 2009 .
[39] Zhenjiang Cui,et al. Effects of UV cure on glass structure and fracture properties of nanoporous carbon-doped oxide thin films , 2008 .
[40] B. C. Daly,et al. Optical pump-probe measurements of sound velocity and thermal conductivity of hydrogenated amorphous carbon films , 2008 .
[41] A. Balandin,et al. Thermal conductivity of ultrathin tetrahedral amorphous carbon films , 2008 .
[42] R. Dauskardt,et al. Superior mechanical properties of dense and porous organic/inorganic hybrid thin films , 2008 .
[43] R. Dauskardt,et al. Molecular Network Reinforcement of Sol–Gel Glasses , 2007 .
[44] V. Jousseaume,et al. a-SiC:H low-k deposition as copper diffusion barrier layer in advanced microelectronic interconnections , 2007 .
[45] S. Kondo,et al. Carbon-Doped Silicon Oxide Films with Hydrocarbon Network Bonds for Low-k Dielectrics: Theoretical Investigations , 2007 .
[46] D. Miracle,et al. A topological basis for bulk glass formation , 2007 .
[47] I. Balberg,et al. Fundamental transport processes in ensembles of silicon quantum dots , 2007 .
[48] G. A. Antonelli,et al. Simple bond energy approach for non-destructive measurements of the fracture toughness of brittle materials , 2007 .
[49] V. Jousseaume,et al. Comparison Between E-beam and Ultraviolet Curing to Perform Porous a-SiOC : H , 2007 .
[50] J. Fischer,et al. Single Wall Carbon Nanotube/Polyethylene Nanocomposites: Thermal and Electrical Conductivity , 2007 .
[51] J. C. Phillips,et al. Onset of rigidity in glasses: From random to self-organized networks , 2006, cond-mat/0609732.
[52] J. Mauro,et al. Modeling of Rigidity Percolation and Incipient Plasticity in Germanium–Selenium Glasses , 2007 .
[53] Alexander A. Balandin,et al. Thermal conductivity of diamond-like carbon films , 2006 .
[54] M. Loboda,et al. Advanced chemical vapor deposition silicon carbide barrier technology for ultralow permeability applications , 2006 .
[55] D. Gidley,et al. POSITRON ANNIHILATION AS A METHOD TO CHARACTERIZE POROUS MATERIALS , 2006 .
[56] Rui Huang,et al. Effect of passivation on stress relaxation in electroplated copper films , 2006 .
[57] T. Lu,et al. A novel polycarbosilane-based low-k dielectric material , 2006 .
[58] Tahui Wang,et al. Comparison of characteristics and integration of copper diffusion-barrier dielectrics , 2006 .
[59] V. Rouessac,et al. Precursor chemistry for ULK CVD , 2005 .
[60] G. Ghibaudo,et al. Review on high-k dielectrics reliability issues , 2005, IEEE Transactions on Device and Materials Reliability.
[61] K. Gleason,et al. Effects of condensation reactions on the structural, mechanical, and electrical properties of plasma-deposited organosilicon thin films from octamethylcyclotetrasiloxane , 2005 .
[62] Martin Laurenzis,et al. Electrical percolation characteristics of Ge2Sb2Te5 and Sn doped Ge2Sb2Te5 thin films during the amorphous to crystalline phase transition , 2005 .
[63] Jun He,et al. > Replace This Line with Your Paper Identification Number (double-click Here to Edit) < 1 Materials Impact on Interconnects Process Technology and Reliability , 2004 .
[64] F. Iacopi,et al. Challenges for structural stability of ultra-low- k -based interconnects , 2004 .
[65] R. Dauskardt,et al. Toughening of nanoporous glasses using porogen residuals , 2004, Nature materials.
[66] Tracey Scherban,et al. Compositional effects on electrical and mechanical properties in carbon-doped oxide dielectric films: Application of Fourier-transform infrared spectroscopy , 2004 .
[67] Seung Yeop Myong,et al. Improvement of pin-type amorphous silicon solar cell performance by employing double silicon-carbide p -layer structure , 2004 .
[68] Bok Heon Kim,et al. Development and Characterization of a PECVD Silicon Nitride for Damascene Applications , 2004 .
[69] Stuart F Cogan,et al. Plasma-enhanced chemical vapor deposited silicon carbide as an implantable dielectric coating. , 2003, Journal of biomedical materials research. Part A.
[70] Stefan Schulz,et al. Thermal conductivity of ultra low- k dielectrics , 2003 .
[71] M. Liang,et al. Physical and Barrier Properties of Plasma-Enhanced Chemical Vapor Deposited α-SiCN:H Films with Different Hydrogen Contents , 2003 .
[72] M. Liang,et al. Physical and Barrier Properties of Plasma-Enhanced Chemical Vapor Deposited α-SiC:H Films from Trimethylsilane and Tetramethylsilane , 2003 .
[73] E. Sleeckx,et al. Process Optimization and Integration of Trimethylsilane-Deposited α-SiC:H and α-SiCO:H Dielectric Thin Films for Damascene Processing , 2003 .
[74] Colette Lacabanne,et al. DC and AC conductivity of carbon nanotubes-polyepoxy composites , 2003 .
[75] Karen Maex,et al. Low dielectric constant materials for microelectronics , 2003 .
[76] K. Gleason,et al. Structure and mechanical properties of thin films deposited from 1,3,5-trimethyl-1,3,5-trivinylcyclotrisiloxane and water , 2003 .
[77] A. Volinsky,et al. Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation , 2003 .
[78] K. Gleason,et al. Plasma-enhanced chemical vapor deposition of low-k dielectric films using methylsilane, dimethylsilane, and trimethylsilane precursors , 2003 .
[79] P. Ho,et al. Porosity effect on the dielectric constant and thermomechanical properties of organosilicate films , 2002 .
[80] B. C. Daly,et al. Optical pump and probe measurement of the thermal conductivity of low-k dielectric thin films , 2002 .
[81] Duncan M. Price,et al. Thermal conductivity of PTFE and PTFE composites , 2002 .
[82] P. Kohl,et al. Porous Methylsilsesquioxane for Low-k Dielectric Applications , 2001 .
[83] Punit Boolchand,et al. Rigidity transitions in binary Ge–Se glasses and the intermediate phase , 2001 .
[84] Y. Homma,et al. Heat and Moisture Resistance of Siloxane-Based Low-Dielectric-Constant Materials , 2001 .
[85] M. S. Hwang,et al. Origin of low dielectric constant of carbon-incorporated silicon oxide film deposited by plasma enhanced chemical vapor deposition , 2001 .
[86] H. Treichel,et al. Low dielectric constant materials , 2001 .
[87] Matthieu Micoulaut,et al. Glass structure, rigidity transitions and the intermediate phase in the Ge–As–Se ternary , 2000 .
[88] Thermal conductivity of amorphous carbon thin films , 2000, cond-mat/0008084.
[89] A. Varshneya. Some comments on physical properties of chalcogenide glasses , 2000 .
[90] M. R. Baklanov,et al. Determination of pore size distribution in thin films by ellipsometric porosimetry , 2000 .
[91] G. Mannaert,et al. Low temperature oxidation and selective etching of chemical vapor deposition a-SiC:H films , 2000 .
[92] Donald J. Jacobs,et al. Self-organization in network glasses , 2000 .
[93] Nicolas Ledermann,et al. Sputtered silicon carbide thin films as protective coating for MEMS applications , 2000 .
[94] J. Robertson,et al. Elastic constants of tetrahedral amorphous carbon films by surface Brillouin scattering , 1999 .
[95] I. Bloom,et al. CRITICAL BEHAVIOR OF THE ELECTRICAL TRANSPORT PROPERTIES IN A TUNNELING-PERCOLATION SYSTEM , 1999 .
[96] R. Horng,et al. Plasma-deposited amorphous silicon carbide films for micromachined fluidic channels , 1999 .
[97] K. S. Sangunni,et al. Optical and Thermal Diffusivity Measurement of Ge-Se-Te Glasses by Photoacoustic Technique , 1999 .
[98] Sushil Kumar,et al. Possible solution to the problem of high built-up stresses in diamond-like carbon films , 1999 .
[99] M. Loboda. New solutions for intermetal dielectrics using trimethylsilane-based PECVD processes , 1999 .
[100] F. C. Marques,et al. Hard hydrogenated carbon films with low stress , 1998 .
[101] Y. Lifshitz,et al. Non-destructive characterization of mechanical and structural properties of amorphous diamond-like carbon films , 1998 .
[102] O. Matsuda,et al. Relation of structural and elastic crossover length investigated by low-frequency Raman scattering in Ge x Se 1-x glasses , 1998 .
[103] G. Somorjai,et al. Continuum Force Microscopy Study of the Elastic Modulus, Hardness and Friction of Polyethylene and Polypropylene Surfaces , 1998 .
[104] A. Varshneya,et al. Structure-property inter-relations in chalcogenide glasses and their practical implications , 1997 .
[105] P. Boolchand,et al. Role of network connectivity on the elastic, plastic and thermal behavior of covalent glasses , 1997 .
[106] D. Edell,et al. Flexible fluorocarbon wire coatings by pulsed plasma enhanced chemical vapor deposition , 1997 .
[107] P. Boolchand,et al. Direct Evidence for Stiffness Threshold in Chalcogenide Glasses , 1997 .
[108] D. Arsova,et al. Thermal diffusivity of Ge-As-Se(S) glasses , 1997 .
[109] Zhang,et al. Influence of one-fold-coordinated atoms on mechanical properties of covalent networks. , 1996, Physical review. B, Condensed matter.
[110] Jung,et al. Preparation and properties of highly tetrahedral hydrogenated amorphous carbon. , 1996, Physical review. B, Condensed matter.
[111] D. Talwar,et al. THERMAL EXPANSION COEFFICIENT OF 3C-SIC , 1995 .
[112] P. Hess,et al. Mechanical and elastic properties of amorphous hydrogenated silicon films studied by broadband surface acoustic wave spectroscopy , 1995 .
[113] A. Varshneya,et al. Configurational arrangements in chalcogenide glasses: A new perspective on Phillips' constraint theory , 1995 .
[114] M. Thorpe. Bulk and surface floppy modes , 1995 .
[115] W. Windl,et al. Ab initio calculation of structural and lattice-dynamical properties of silicon carbide. , 1994, Physical review. B, Condensed matter.
[116] Thorpe,et al. Glass-forming tendency, percolation of rigidity, and onefold-coordinated atoms in covalent networks. , 1994, Physical review. B, Condensed matter.
[117] Christopher J. Morath,et al. Picosecond optical studies of amorphous diamond and diamondlike carbon: Thermal conductivity and longitudinal sound velocity , 1994 .
[118] M. Loboda,et al. Plasma‐enhanced chemical vapor deposition of a‐SiC:H films from organosilicon precursors , 1994 .
[119] H. Pépin,et al. Effect of rapid thermal annealing on both the stress and the bonding states of a-SiC:H films , 1993 .
[120] Thorpe,et al. Structural model for crystalline and amorphous Si-Ge alloys. , 1993, Physical review. B, Condensed matter.
[121] Robertson,et al. Properties of filtered-ion-beam-deposited diamondlike carbon as a function of ion energy. , 1993, Physical review. B, Condensed matter.
[122] Leite,et al. Photoacoustic characterization of chalcogenide glasses: Thermal diffusivity of GexTe1-x. , 1992, Physical review. B, Condensed matter.
[123] Smith,et al. Atomic bonding in amorphous hydrogenated silicon carbide alloys: A statistical thermodynamic approach. , 1992, Physical review. B, Condensed matter.
[124] William A. Goddard,et al. The Hessian biased force field for silicon nitride ceramics: Predictions of thermodynamic and mechanical properties for α‐ and β‐Si3N4 , 1992 .
[125] H. Pépin,et al. Characterization of a‐SiC:H films produced in a standard plasma enhanced chemical vapor deposition system for x‐ray mask application , 1992 .
[126] A. Srinivasan,et al. Thermal diffusivity of IV-V-VI glassess - An evidence for the existence of a mechanical threshold , 1992 .
[127] Tersoff,et al. Elastic properties of a network model of glasses. , 1992, Physical review letters.
[128] Robertson. Mechanical properties and coordinations of amorphous carbons. , 1992, Physical review letters.
[129] Jacob Philip,et al. Composition dependence of optical band gap and thermal diffusivity of AsTeSe glasses , 1992 .
[130] A. Varshneya,et al. Microhardness and indentation toughness versus average coordination number in isostructural chalcogenide glass systems , 1991 .
[131] Neumann,et al. Vibrational densities of states and network rigidity in chalcogenide glasses. , 1991, Physical review. B, Condensed matter.
[132] Jiang. Rayleigh mode in amorphous hydrogenated carbon films. , 1991, Physical review. B, Condensed matter.
[133] Arun K. Varshneya,et al. MICROHARDNESS, SURFACE TOUGHNESS AND AVERAGE COORDINATION NUMBER IN CHALCOGENIDE GLASSES , 1990 .
[134] Wang,et al. Scaling properties of fracture toughness in random materials. , 1990, Physical review. B, Condensed matter.
[135] A. R. Cooper,et al. Topologically disordered networks of rigid polytopes , 1990 .
[136] Wei,et al. Thermal diffusivity of isotopically enriched 12C diamond. , 1990, Physical review. B, Condensed matter.
[137] K. Gerstenberg. Film deposition in a radial flow reactor by plasma polymerization of hexamethyldisilazane , 1990 .
[138] Lindsay,et al. Fragility of Ge-As-Se glass-forming liquids in relation to rigidity percolation, and the Kauzmann paradox. , 1990, Physical review letters.
[139] M. Sahimi,et al. Scaling Laws for Transport, Mechanical and Fracture Properties of Disordered Materials , 1990 .
[140] Xin Jiang,et al. The hardness and Young’s modulus of amorphous hydrogenated carbon and silicon films measured with an ultralow load indenter , 1989 .
[141] Cai,et al. Floppy modes in network glasses. , 1989, Physical review. B, Condensed matter.
[142] Yun,et al. Onset of rigidity in Se1-xGex glasses: Ultrasonic elastic moduli. , 1989, Physical review. B, Condensed matter.
[143] Madhusoodanan,et al. Thermal transport near the glass transition in bulk As-Se glasses. , 1989, Physical review. B, Condensed matter.
[144] Tanaka,et al. Structural phase transitions in chalcogenide glasses. , 1989, Physical review. B, Condensed matter.
[145] Measurement of the Young's modulus for structural characterization of amorphous Si:C:N:H-films , 1989 .
[146] Madhusoodanan,et al. Percolation threshold of thermal conduction in AxIVB , 1988, Physical review. B, Condensed matter.
[147] J. Angus,et al. Dense ‘‘diamondlike’’ hydrocarbons as random covalent networks , 1988 .
[148] Tang,et al. Percolation of elastic networks under tension. , 1988, Physical review. B, Condensed matter.
[149] Tang,et al. Mapping between random central-force networks and random resistor networks. , 1987, Physical review. B, Condensed matter.
[150] Duxbury,et al. Breakdown properties of quenched random systems: The random-fuse network. , 1987, Physical review. B, Condensed matter.
[151] Smith,et al. Optical constants of a series of amorphous hydrogenated silicon-carbon alloy films: Dependence of optical response on film microstructure and evidence for homogeneous chemical ordering. , 1987, Physical review. B, Condensed matter.
[152] W. Claassen,et al. Ion bombardment-induced mechanical stress in plasma-enhanced deposited silicon nitride and silicon oxynitride films , 1987 .
[153] Feng,et al. Transport properties of continuum systems near the percolation threshold. , 1987, Physical review. B, Condensed matter.
[154] Keiji Tanaka. Elastic properties of covalent glasses , 1986 .
[155] J. Perrin,et al. Cross-linking and average coordination in plasma-polymerized hydro- and fluorocarbons , 1986 .
[156] Lindsay,et al. Rigidity percolation in the germanium-arsenic-selenium alloy system. , 1986, Physical review letters.
[157] Goddard,et al. Elastic percolation models for cohesive mechanical failure in heterogeneous systems. , 1986, Physical review. B, Condensed matter.
[158] Phillips. Vibrational thresholds near critical average coordination in alloy network glasses. , 1985, Physical review. B, Condensed matter.
[159] Keiji Tanaka. Glass transition of covalent glasses , 1985 .
[160] Lawrence R. Doolittle,et al. Algorithms for the rapid simulation of Rutherford backscattering spectra , 1985 .
[161] E. Garboczi,et al. Effective-medium theory of percolation on central-force elastic networks. II. Further results. , 1985, Physical review. B, Condensed matter.
[162] Thorpe,et al. Elastic properties of glasses. , 1985, Physical review letters.
[163] J. C. Phillips,et al. Constraint theory, vector percolation and glass formation , 1985 .
[164] A. Zunger,et al. Bond lengths around isovalent impurities and in semiconductor solid solutions , 1984 .
[165] A. Bubenzer,et al. Bonding in hydrogenated hard carbon studied by optical spectroscopy , 1983 .
[166] G. Lucovsky,et al. Nitrogen-bonding environments in glow-discharge—deposited a − Si : H films , 1983 .
[167] Michael Thorpe,et al. Continuous deformations in random networks , 1983 .
[168] A. Feltz,et al. Glass formation and properties of chalcogenide systems XXVI: Permittivity and the structure of glasses AsxSe1−x and GexSe1−x , 1983 .
[169] Claude M. Penchina,et al. The physics of amorphous solids , 1983 .
[170] G. Döhler,et al. A topological-dynamical model of amorphycity , 1980 .
[171] J. C. Phillips,et al. Topology of covalent non-crystalline solids I: Short-range order in chalcogenide alloys , 1979 .
[172] F. L. Galeener,et al. Band limits and the vibrational spectra of tetrahedral glasses , 1979 .
[173] J. Bernasconi. Real-space renormalization of bond-disordered conductance lattices , 1978 .
[174] Benjamin Abeles,et al. Percolation Conductivity in W-Al 2 O 3 Granular Metal Films , 1975 .
[175] S. Kirkpatrick. Percolation and Conduction , 1973 .
[176] Scott Kirkpatrick,et al. Classical Transport in Disordered Media: Scaling and Effective-Medium Theories , 1971 .
[177] M. Abkowitz,et al. Electrical Properties of Amorphous Se, As 2 Se 3 , and As 2 S 3 , 1971 .
[178] J. W. Essam,et al. Critical Percolation Probabilities by Series Methods , 1964 .
[179] J. M. Hammersley,et al. Critical Percolation Probabilities (Bond Problem) , 1961 .