Parallel computations of 3D flows in resin transfer molding

In this work, fast 3D non-isothermal mold flow simulation programs that take advantage of the new generation parallel supercomputers such as Cray C90 and TMC CM-5 are developed and evaluated. The codes are based on the FE/CV formulations and utilize “overfill and redistribute scheme” to enhance the flow front movement. They rely on recently developed fast iterative solvers: the generalized minimal residual solver and the quasi minimal residual solver. In the examples, the performance of the iterative solvers and the overfill and redistribute scheme is evaluated, and a 3D simulation using 104,000 HEXA8 element mesh is performed.