인터포저를 이용한 PoP 패키지에서 through via의 전기적 파라미터 추출

This paper describes a method to extract electrical parameters of the through via in Package-on-Package(PoP) with interposer from s-parameters. Using the extraction procedure the effect of the distance between the signal and GND vias on the electrical characteristic of single-ended through hole vias is discussed.