Geometric modelling of IC die bonds for inspection
暂无分享，去创建一个
Abstract This paper describes an algorithm that has been developed to inspect the quality of wire bonds on an IC die. It employs a geometric model to approximate the shape of the bond so that any aberrations from the specified dimensions can be easily identified.
[1] PAUL D. SAMPSON,et al. Fitting conic sections to "very scattered" data: An iterative refinement of the bookstein algorithm , 1982, Comput. Graph. Image Process..
[2] Berthold K. P. Horn. A problem in computer vision , 1975 .
[3] Takafumi Miyatake,et al. An Automatic Position Recognition Technique for LSI Assembly , 1977, IJCAI.
[4] Masakazu Ejiri,et al. A Transistor Wire-Bonding System Utilizing Multiple Local Pattern Matching Techniques , 1976, IEEE Transactions on Systems, Man, and Cybernetics.