Positive bias temperature instability in MOSFETs
暂无分享,去创建一个
[1] James Stasiak,et al. Trap creation in silicon dioxide produced by hot electrons , 1989 .
[2] S. Nakajima,et al. Hot-carrier-injected oxide region and hot-electron trapping as the main cause in Si nMOSFET degradation , 1987, IEEE Transactions on Electron Devices.
[3] H. Iwai,et al. Interface state generation under long-term positive-bias temperature stress for a p/sup +/ poly gate MOS structure , 1989 .
[4] Donald R. Young,et al. Electron trapping by radiation‐induced charge in MOS devices , 1976 .
[5] E. H. Nicollian,et al. Mechanism of negative‐bias‐temperature instability , 1991 .
[6] B. S. Doyle,et al. A lifetime prediction method for hot-carrier degradation in surface-channel p-MOS devices , 1990 .
[7] M. Heyns,et al. Trap generation and electron detrapping in SiO2 during high‐field stressing of metal‐oxide‐semiconductor structures , 1984 .
[8] D. Schmitt-Landsiedel,et al. Dynamic degradation in MOSFET's. II. Application in the circuit environment , 1991 .
[9] R.L. Johnston,et al. Experimental derivation of the source and drain resistance of MOS transistors , 1980, IEEE Transactions on Electron Devices.
[10] Chih-Tang Sah,et al. Models and experiments on degradation of oxidized silicon , 1987 .
[11] K. Jeppson,et al. Negative bias stress of MOS devices at high electric fields and degradation of MNOS devices , 1977 .
[12] Hisham Z. Massoud,et al. Electron trapping in SiO2 at 295 and 77 °K , 1979 .
[13] D. Arnold,et al. Impact ionization, trap creation, degradation, and breakdown in silicon dioxide films on silicon , 1993 .
[14] Chenming Hu,et al. Electron-trap generation by recombination of electrons and holes in SiO2 , 1987 .
[15] G. Groeseneken,et al. Degradation of tunnel-oxide floating-gate EEPROM devices and the correlation with high field-current-induced degradation of thin gate oxides , 1989 .
[16] William Eccleston,et al. A quantitative investigation of electron detrapping in SiO2 under Fowler–Nordheim stress , 1992 .
[17] J. M. Andrews,et al. Electrochemical Charging of Thermal SiO2 Films by Injected Electron Currents , 1971 .
[18] B. Doyle,et al. NBTI-enhanced hot carrier damage in p-channel MOSFETs , 1991, International Electron Devices Meeting 1991 [Technical Digest].
[19] G. Groeseneken,et al. Consistent model for the hot-carrier degradation in n-channel and p-channel MOSFETs , 1988 .
[20] D. J. Breed. Non-ionic room temperature instabilities in MOS devices , 1974 .
[21] Hiroshi Iwai,et al. Analysis of hot-carrier-induced degradation mode on pMOSFET's , 1990 .
[22] Ping-Keung Ko,et al. Hot-carrier current modeling and device degradation in surface-channel p-MOSFETs , 1990 .
[23] Tso-Ping Ma,et al. Comparison of interface-state generation by 25-keV electron beam irradiation in p-type and n-type MOS capacitors , 1975 .
[24] A. S. Grove,et al. Characteristics of the Surface‐State Charge (Qss) of Thermally Oxidized Silicon , 1967 .
[25] U. Schwalke,et al. Bias temperature reliability of n/sup +/ and p/sup +/ polysilicon gated NMOSFETs and PMOSFETs , 1993, 31st Annual Proceedings Reliability Physics 1993.
[26] R. J. Strain,et al. On the Formation of Surface States during Stress Aging of Thermal Si ‐ SiO2 Interfaces , 1973 .
[27] William Eccleston,et al. Electron trap generation in thermally grown SiO2 under Fowler-Nordheim stress , 1992 .
[28] T. Suzuki,et al. Boron and phosphorus diffusion through an SiO2 layer from a doped polycrystalline Si source under various drive-in ambients , 1975 .
[29] Chenming Hu,et al. Hot-Electron-Induced MOSFET Degradation - Model, Monitor, and Improvement , 1985, IEEE Journal of Solid-State Circuits.
[30] Y. Sato,et al. The process dependence on positive bias temperature aging instability of p/sup +/(B) polysilicon-gate MOS devices , 1993 .
[31] H. Levinstein,et al. Effect of high-temperature H2-anneals on the slow-trapping instability of MOS structures , 1978 .
[32] M. Koyanagi,et al. Hot-electron-induced punchthrough (HEIP) effect in submicrometer PMOSFET's , 1987, IEEE Transactions on Electron Devices.