Multi-chip integration by photonic wire bonding: Connecting surface and edge emitting lasers to silicon chips
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C. Koos | W. Freude | P. Marin | M. Thiel | A. Hofmann | U. Troppenz | M. Blaicher | T. Hoose | M. Moehrle | M. Billah | P.-I Dietrich | N. Lindenmann | P. Simon | J. Hoffmann | M. L. Goedecke | W. Freude | C. Koos | M. Thiel | P. Dietrich | M. Blaicher | M. Möhrle | M. Billah | T. Hoose | N. Lindenmann | A. Hofmann | U. Troppenz | M. Goedecke | P. Marin | J. Hoffmann | P. Simon
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