Materials issues in the processing, the operation and the reliability of MEMS

In this article materials issues that arise during the processing and operation of micro-electro mechanical systems devices (MEMS), and their impact on the functionality and reliability, are discussed. The article starts with the example of an RF-MEMS switch process flow, indicating how and why certain materials are chosen. Then two specific MEMS materials issues, e.g. stiction and stress, are covered. Finally, the so-called 'zero-level' packaging of MEMS as well as the effect packaging can have on the device and its operation will be reviewed.

[1]  K. Maex,et al.  Stress relaxation in Al-Cu and Al-Si-Cu thin films , 1999 .

[2]  S. Senturia.  Microsystem Design , 2000 .

[3]  Henri V. Jansen,et al.  Self-aligned 0-level sealing of MEMS devices by a two layer thin film reflow process , 2003, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS 2003..

[4]  H. Tilmans,et al.  Electrostatically driven vacuum-encapsulated polysilicon resonators part II. theory and performance , 1994 .

[5]  V. Fusco,et al.  Low-loss CPW lines on surface stabilized high-resistivity silicon , 1999, IEEE Microwave and Guided Wave Letters.

[6]  Krishna C. Saraswat,et al.  Deposition and Properties of Low‐Pressure Chemical‐Vapor Deposited Polycrystalline Silicon‐Germanium Films , 1994 .

[7]  Ann Witvrouw,et al.  Poly SiGe, a promising material for MEMS monolithic integration with the driving electronics , 2002 .

[8]  Gabriel M. Rebeiz,et al.  High-isolation CPW MEMS shunt switches. 1. Modeling , 2000 .

[9]  E. Beyne,et al.  The indent reflow sealing (IRS) technique-a method for the fabrication of sealed cavities for MEMS devices , 2000, Journal of Microelectromechanical Systems.

[10]  Gabriel M. Rebeiz.  RF MEMS: Theory, Design and Technology , 2003 .

[11]  D. Beebe,et al.  The fabrication of nonplanar spin-on glass microstructures , 1999 .

[12]  R. Puers,et al.  Creep characterization of Al alloy thin films for use in MEMS applications , 2004 .

[13]  Bharat Bhushan,et al.  Adhesion and stiction: Mechanisms, measurement techniques, and methods for reduction , 2003 .

[14]  Miko Elwenspoek,et al.  Micro resonant force gauges , 1992 .

[15]  H. Nathanson,et al.  The resonant gate transistor , 1967 .

[16]  Robert Puers,et al.  A low frequency electrical test set-up for the reliability assessment of capacitive RF MEMS switches , 2003 .

[17]  Robert Puers,et al.  Pull-in voltage analysis of electrostatically actuated beam structures with fixed–fixed and fixed–free end conditions , 2002 .

[18]  S. Eshelman,et al.  Micromachined low-loss microwave switches , 1999 .

[19]  Robert Puers,et al.  A wet release process for fabricating slender and compliant suspended micro-mechanical structures $ , 2003 .

[20]  H. Bender,et al.  Comparison between wet HF etching and vapor HF etching for sacrificial oxide removal , 2000 .

[21]  M. Madou.  Fundamentals of microfabrication , 1997 .

[22]  Gabriel M. Rebeiz,et al.  High-isolation CPW MEMS shunt switches. 2. Design , 2000 .