Real-Time Voltage and Resistance Features in Microprobe Testing Process

A testing circuit of probe is designed to understand the real-time characteristics of the probe during testing process. The constant resistance voltage and probe voltage are measured simultaneously by DSOX2022A oscilloscope, and the real-time resistance of probe is calculated. The result shows that the probe resistance varies from the initial infinity to approximately $1~\Omega $ at 0.2 ms when the probe is in contact with the copper substrate. The resistance of the probe is gradually reduced to relatively stable value with the increasing of compressed displacement. The probe resistance increases badly in initial 30 times testing when the angle between probe and copper changes from 0° to 2°, and reduces to a stable value after 20-30 times testing.

[1]  Lei Han,et al.  Study on a cooling system based on thermoelectric cooler for thermal management of high-power LEDs , 2011, Microelectron. Reliab..

[2]  Junhui Li,et al.  Dynamic and Electrical Characteristics of Microprobe Testing in Microelectronics Packaging , 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[3]  Luhua Deng,et al.  Interfacial Microstructures and Thermodynamics of Thermosonic Cu-Wire Bonding , 2011, IEEE Electron Device Letters.

[4]  Ji-An Duan,et al.  A novel levitation control strategy for a class of redundant actuation maglev system , 2011 .

[5]  Lei Han,et al.  High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux , 2014 .

[6]  H. Zhou,et al.  A Method for Deriving the Analytical Structure of a Broad Class of Typical Interval Type-2 Mamdani Fuzzy Controllers , 2013, IEEE Transactions on Fuzzy Systems.

[7]  He Jin-qi A New Packaging Trend:Wafer Level Packaging , 2008 .

[8]  Yang Xia,et al.  The soft-landing features of a micro-magnetorheological fluid damper , 2015 .

[9]  Liang Cheng,et al.  State Detection of Bond Wires in IGBT Modules Using Eddy Current Pulsed Thermography , 2014, IEEE Transactions on Power Electronics.

[10]  Yun Chen,et al.  Effect of Capillary Trace on Dynamic Loop Profile Evolution in Thermosonic Wire Bonding , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[11]  Vadim V. Silberschmidt,et al.  Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds , 2011 .

[12]  Wang Hui Analysis and Research Results of Wafer Probing on Abnormal Problem , 2007 .

[13]  Han Lei,et al.  Dynamics Features of Cu-Wire Bonding During Overhang Bonding Process , 2011, IEEE Electron Device Letters.

[14]  Fuliang Wang,et al.  Stress-induced atom diffusion at thermosonic flip chip bonding interface , 2009 .

[15]  Junhui Li,et al.  Interface mechanism of ultrasonic flip chip bonding , 2007 .