Circuit model and signal integrity analysis for multilayer printed circuit board interconnection

A circuit modeling method and signal integrity analysis approach for multilayer printed circuit board interconnection based on the partial equivalent element circuit PEEC method is proposed. The multilayer interconnection structure is divided into a via hole and microstrip lines. A three-dimensional 3D model of a via hole structure is constructed using the PEEC method with Rao-Wilton-Glisson RWG basis functions. The microstrip lines on the top and bottom layers are modeled by PEEC method with RWG basis functions and discrete complex image. The model order reduction method is used to analyze effectively the via hole structure. The equivalent circuit of the via hole structure is simplified, and its physical meaning is defined. The scattering S parameter obtained from the proposed method is consistent with simulation results, which are computed using the commercial 3D electromagnetic field analysis software FEKO. The correctness of the proposed method is validated. The S parameters of different dimensions are simulated, and the effects of these dimensions on the electromagnetic characteristics of the via hole structure are analyzed. The model of the entire structure is used to conduct eye diagram simulation. © 2013 Wiley Periodicals, Inc. Int J RF and Microwave CAE 24:478-489, 2014.

[1]  Roger F. Harrington,et al.  The excess capacitance of a microstrip via in a dielectric substrate , 1990, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..

[2]  Daniël De Zutter,et al.  Capacitance of a circular symmetric model of a via hole including finite ground plane thickness , 1991 .

[3]  Jie Wang,et al.  A derived physically expressive circuit model for multilayer RF embedded passives , 2006 .

[4]  Chung-Kuan Cheng,et al.  Realizable parasitic reduction using generalized Y-Δ transformation , 2003, DAC.

[5]  Song Xia,et al.  Experimental Verification of Anisotropic Three-dimensional Left-handed Metamaterial Composed of Jerusalem Crosses , 2010 .

[6]  Tao V. Nguyen,et al.  Characterization of differential via holes using equivalent circuit extraction technique , 2007 .

[7]  Ruey-Beei Wu,et al.  Full wave characterization of a through hole via using the matrix-penciled moment method , 1994 .

[8]  I. Bahl.  Lumped Elements for RF and Microwave Circuits , 2003 .

[9]  G. I. Costache,et al.  Finite-element method applied to EMC problems (PCB environment) , 1993 .

[10]  G. Mur.  Absorbing Boundary Conditions for the Finite-Difference Approximation of the Time-Domain Electromagnetic-Field Equations , 1981, IEEE Transactions on Electromagnetic Compatibility.

[11]  Hailian Li,et al.  The Feasibility of Numerical Calculations of Vias Using the Matrix-Penciled Moment Method , 2010 .

[12]  R. Harrington,et al.  Quasi-static analysis of a microstrip via through a hole in a ground plane , 1988 .

[13]  Shuji Maeda,et al.  Full wave analysis of propagation characteristics of a through hole using the finite-difference time-domain method , 1991, 1991 IEEE MTT-S International Microwave Symposium Digest.

[14]  Jing Wu,et al.  Signal integrity analysis for high‐speed circuit PCB interconnection with an efficient full wave method , 2013 .

[15]  C.L. Holloway,et al.  Meander delay line challenge problem: a comparison using FDTD, FEM and MoM , 2001, 2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH37161).

[16]  Raj Mittra,et al.  Time-domain electromagnetic analysis of interconnects in a computer chip package , 1992 .

[17]  Yulu Tian,et al.  Mode Conversion at Via Discontinuities in Microwave Circuits , 2010 .