Deformation analysis with temporal speckle pattern interferometry

The continual deformation of an object will lead to a temporal speckle pattern. By analyzing this time-dependent speckle pattern the temporal deformations of the object can be obtained. We propose a method for measuring the displacement components caused by defor- mations using the temporal speckle pattern interferometry (TSPI). By capturing a series of speckle interference patterns related to the object deformations, we can get the fluctuations in the intensity of the interfer- ence patterns. Further, the phase maps for whole-field object displace- ments are calculated with the inversion of the temporal interference in- tensities by estimating both the average intensity and the modulation. In this way, one can quantitatively measure temporal displacements simply using a conventional electronic speckle pattern interferometry (ESPI) system without phase shifting or a carrier. An elaboration of the TSPI is presented and out-of-plane displacements caused by pressure and ther- mal deformations are measured. © 2001 Society of Photo-Optical Instrumentation Engineers. (DOI: 10.1117/1.1336527)

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