Modeling and analysis of high-speed sources and serial links for signal integrity
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[1] G. Selli,et al. Model-to-hardware correlation of physics based via models with the parallel plate impedance included , 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..
[2] R. Collin. Field theory of guided waves , 1960 .
[3] V. Kasturi,et al. Quantifying electric and magnetic field coupling from integrated circuits with TEM cell measurements , 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..
[4] Clayton R. Paul,et al. Analysis of Multiconductor Transmission Lines , 1994 .
[5] Constantine A. Balanis,et al. Antenna Theory: Analysis and Design , 1982 .
[6] Xiaoxiong Gu,et al. Impedance design for multi-layered vias , 2008, 2008 IEEE-EPEP Electrical Performance of Electronic Packaging.
[7] Raj Mittra,et al. Computation of the equivalent capacitance of a via in a multilayered board using the closed-form Green's function , 1996 .
[8] Barry K. Gilbert,et al. Wave model solution to the ground/power plane noise problem , 1995 .
[9] R. Harrington,et al. Quasi-static analysis of a microstrip via through a hole in a ground plane , 1988 .
[10] Qin Li,et al. Analysis of a large number of vias and differential signaling in multilayered structures , 2003 .
[11] Luís Miguel Silveira,et al. Passive constrained rational approximation algorithm using Nevanlinna-Pick interpolation , 2002, Proceedings 2002 Design, Automation and Test in Europe Conference and Exhibition.
[12] Jun Fan,et al. Investigation of crosstalk among vias , 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.
[13] Simon Ramo,et al. Fields and waves in modern radio , 1944 .
[14] Yahya Rahmat-Samii,et al. Electromagnetic Optimization by Genetic Algorithms , 1999 .
[15] R. Gulrajani. The forward and inverse problems of electrocardiography. , 1998, IEEE engineering in medicine and biology magazine : the quarterly magazine of the Engineering in Medicine & Biology Society.
[16] Francesco de Paulis. Block level link path design and multilayer via transition model assembly using S-parameters , 2008 .
[17] Shuji Maeda,et al. Full wave analysis of propagation characteristics of a through hole using the finite-difference time-domain method , 1991, 1991 IEEE MTT-S International Microwave Symposium Digest.
[18] B. Mazari,et al. Modeling Magnetic Radiations of Electronic Circuits Using Near-Field Scanning Method , 2007, IEEE Transactions on Electromagnetic Compatibility.
[19] Andreas C. Cangellaris,et al. Frequency-dependent inductance and resistance calculation for three-dimensional structures in high-speed interconnect systems , 1989 .
[20] C. Paul. Introduction to electromagnetic compatibility , 2005 .
[21] K. C. Gupta,et al. Segmentation Method Using Impedance Matrices For Analysis Of Planar Microwave Circuits , 1981 .
[22] A. Orlandi,et al. Applications of FSV to EMC and SI data , 2005, 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005..
[23] Jun Fan,et al. Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz , 2009, IEEE Transactions on Microwave Theory and Techniques.
[24] Daniël De Zutter,et al. Capacitance of a circular symmetric model of a via hole including finite ground plane thickness , 1991 .
[25] P. Wilson. On correlating TEM cell and OATS emission measurements , 1995 .
[26] A. Duffy,et al. The feature selective validation (FSV) method , 2005, 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005..
[27] R. Martin Arthur,et al. Direct Inference of the Spectra of Pericardial Potentials Using the Boundary-Element Method , 2004, Annals of Biomedical Engineering.
[28] Leung Tsang,et al. Coupling of vias in electronic packaging and printed circuit board structures with finite ground plane , 2003 .
[29] R. R. Goulette. The Measurement Of Radiated Emissions From Integrated Circuits , 1992, International Symposium on Electromagnetic Compatibility.
[30] R. Throne,et al. A generalized eigensystem approach to the inverse problem of electrocardiography , 1994, IEEE Transactions on Biomedical Engineering.
[31] J. R. James,et al. Assessing the accuracy of wideband electrical data using Hilbert transforms , 1990 .
[32] Jun Fan,et al. Investigation of mixed-mode input impedance of multi-layer differential vias for impedance matching with traces , 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.
[33] S. Grivet-Talocia,et al. A robust causality verification tool for tabulated frequency data , 2006, 2006 IEEE Workship on Signal Propagation on Interconnects.
[34] Xiaoxiong Gu,et al. Application of Foldy-Lax Multiple Scattering Method To Via Analysis in Multi-layered Printed Circuit Board , 2008 .