MAT-Test: A New Method for Thin-Film Materials Characterization Submitted to the Board of Graduate Studies for the Degree of Master of Philosophy by Research (MPhil) in the Cambridge University Engineering Department

..................................................................................................................................i Acknowledgements................................................................................................................ii Table of

[1]  Ylva Bäcklund,et al.  Bulk silicon holding structures for mounting of optical fibers in v-grooves , 1997 .

[2]  S. Senturia,et al.  M-TEST: A test chip for MEMS material property measurement using electrostatically actuated test structures , 1997 .

[3]  R. L. Edwards,et al.  A new technique for measuring the mechanical properties of thin films , 1997 .

[4]  M. Madou Fundamentals of microfabrication , 1997 .

[5]  Beth L. Pruitt Piezoresistive cantilevers for characterizing thin-film gold electrical contacts , 2002 .

[6]  Zhijian Li,et al.  Study of methods for measuring mechanical properties of thin films in microelectromechanical systems (MEMS) , 1995, Proceedings of 4th International Conference on Solid-State and IC Technology.

[7]  K.E. Petersen,et al.  Silicon as a mechanical material , 1982, Proceedings of the IEEE.

[8]  Henry Windischmann,et al.  Intrinsic stress and mechanical properties of hydrogenated silicon carbide produced by plasma‐enhanced chemical vapor deposition , 1991 .

[9]  Stuart B. Brown,et al.  Mechanical properties of structural films , 2001 .

[10]  Zhigang Suo,et al.  Fracture in Thin Films , 2001 .

[11]  William D. Nix,et al.  Mechanical properties of compositionally modulated Au-Ni thin films: Nanoindentation and microcantilever deflection experiments , 1994 .

[12]  D. F. Moore,et al.  Low cost integrated photonic systems , 1997, Conference Proceedings. LEOS '97. 10th Annual Meeting IEEE Lasers and Electro-Optics Society 1997 Annual Meeting.

[13]  Mitsuhiro Shikida,et al.  Micro tensile-test of silicon film having different crystallographic orientations , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).

[14]  B. Jensen,et al.  IMAP: Interferometry for Material Property Measurement in MEMS , 1999 .

[15]  Oliver Kraft,et al.  Measurement of Thin Film Mechanical Properties by Microbeam Bending , 1999 .

[16]  D. F. Moore Thick layers of silicon nitride and other materials for micromechanical structures , 1997 .

[17]  S. D. Senturia,et al.  Correction To "M-test: A Test Chip For Mems Material Property Measurement Using Electrostatically Actuated Test Structures" , 1997 .

[18]  Timothy P. Weihs,et al.  The Determination of Mechanical Parameters and Residual Stresses for Thin Films Using Micro-Cantilever Beams , 1988 .

[19]  D. F. Moore,et al.  The fabrication of suspended microstructures for devices , 1991 .

[20]  Timothy P. Weihs,et al.  Measuring the Strength and Stiffness of Thin Film Materials by Mechanically Deflecting Cantilever Microbeams , 1988 .

[21]  D. G. Ashwell,et al.  The Anticlastic Curvature of Rectangular Beams and Plates , 1950, The Journal of the Royal Aeronautical Society.

[22]  P. Boyle,et al.  Packaging solutions for MEMS/MOEMS using thin films as mechanical components , 2002, Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS.

[23]  Tong-Yi Zhang,et al.  Microbridge testing of silicon nitride thin films deposited on silicon wafers , 2000 .

[24]  Tong-Yi Zhang,et al.  Effect of substrate deformation on the microcantilever beam-bending test , 2000 .

[25]  J. Schweitz,et al.  Influence of surface coatings on elasticity, residual stresses, and fracture properties of silicon microelements , 1989 .

[26]  R. Muller,et al.  Measurement of Young's modulus on microfabricated structures using a surface profiler , 1990, IEEE Proceedings on Micro Electro Mechanical Systems, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots..

[27]  C. J. Wilson,et al.  Fracture testing of silicon microcantilever beams , 1996 .

[28]  M. Gaitan,et al.  IC test structures for multilayer interconnect stress determination , 2000, IEEE Electron Device Letters.

[29]  R. Howe,et al.  Novel microstructures for the in situ measurement of mechanical properties of thin films , 1987 .

[30]  WU MINGC. Micromachining for Optical and Optoelectronic Systems , 1998 .

[31]  David Cebon,et al.  Materials Selection in Mechanical Design , 1992 .

[32]  Jan-Åke Schweitz,et al.  mechanical Characterization of Thin Films by Micromechanical Techniques , 1992 .

[33]  M. Ashby,et al.  Engineering Materials 2: An Introduction to Microstructures, Processing and Design , 1986 .

[34]  Rudolph Earl Peterson,et al.  Stress concentration design factors : charts and relations useful in making strength calculations for machine parts and structural elements , 1953 .

[35]  K. Suzuki,et al.  Measurements of mechanical properties of microfabricated thin films , 1997, Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots.

[36]  W. Fang,et al.  Determining mean and gradient residual stresses in thin films using micromachined cantilevers , 1996 .

[37]  Brian D. Jensen,et al.  Interferometry of actuated microcantilevers to determine material properties and test structure nonidealities in MEMS , 2001 .

[38]  Oliver Kraft,et al.  Measurement of Mechanical Properties in Small Dimensions by Microbeam Deflection , 1998 .

[39]  William N. Sharpe,et al.  Effect of specimen size on Young's modulus and fracture strength of polysilicon , 2001 .

[40]  R. L. Edwards,et al.  Measurements of Young's modulus, Poisson's ratio, and tensile strength of polysilicon , 1997, Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots.

[41]  .May ..id University of Illinois , 1919, The Grants Register 2021.

[42]  K. Petersen,et al.  Young’s modulus measurements of thin films using micromechanics , 1979 .

[43]  J. Wortman,et al.  Young's Modulus, Shear Modulus, and Poisson's Ratio in Silicon and Germanium , 1965 .

[44]  Michael B. Sinclair,et al.  Integrated Platform for Testing MEMS Mechanical Properties at the Wafer Scale by the IMaP Methodology , 2001 .

[45]  Eckhard Quandt,et al.  Determination of elastic modulus of thin films and small specimens using beam bending methods , 1999 .

[46]  Timothy P. Weihs,et al.  Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin films , 1988 .

[47]  J. E. Townsend,et al.  Silicon nitride microclips for optic fibre connectors , 1999 .

[48]  W. Fang,et al.  Comments on measuring thin-film stresses using bi-layer micromachined beams , 1995 .

[49]  D. F. Moore,et al.  Silicon nitride microclips for the kinematic location of optic fibres in silicon V-shaped grooves , 1998 .

[50]  J. Schweitz,et al.  Micromechanical fracture strength of silicon , 1990 .

[51]  M. Elwenspoek,et al.  Silicon Micromachining , 1998 .

[52]  Ksj Pister,et al.  Characterization of the Young's Modulus of CMOS Thin Films , 2001 .

[53]  Michael Gaitan,et al.  MEMS Test Structures for Mechanical Characterization of VLSI Thin Films , 2001 .

[54]  S. Timoshenko,et al.  Theory of Elasticity (3rd ed.) , 1970 .

[55]  W. Fang,et al.  On the buckling behavior of micromachined beams , 1999 .

[56]  S. Senturia Microsystem Design , 2000 .

[57]  Jan-Åke Schweitz,et al.  In Situ Tensile Strength Measurement Of Thick-film And Thin Film Micromacrined Structures , 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.

[58]  Yu-Chong Tai,et al.  Aerodynamic control of a delta-wing using MEMS sensors and actuators , 1997, 1997 International Symposium on Micromechanics and Human Science (Cat. No.97TH8311).

[59]  C. J. Wilson,et al.  Fracture testing of bulk silicon microcantilever beams subjected to a side load , 1996 .

[60]  O. Tabata,et al.  Mechanical property measurements of thin films using load-deflection of composite rectangular membranes , 1989 .

[61]  Ming Qin,et al.  Measurement of Young's modulus of nickel silicide film by a surface profiler , 2000, Proceedings 2000 IEEE Hong Kong Electron Devices Meeting (Cat. No.00TH8503).

[62]  W. R. Dean On the Theory of Elastic Stability , 1925 .

[63]  D. S. Dugdale,et al.  Introduction to the Mechanics of Solids , 1967 .

[64]  R.R.A. Syms,et al.  Recent developments in micromachined silicon , 1999 .

[65]  Carola Strandman,et al.  Modelling of fibre holding elements in silicon , 1999 .

[66]  X. Y. Ye,et al.  Measurement of Young's modulus and residual stress of micromembranes , 1996, MHS'96 Proceedings of the Seventh International Symposium on Micro Machine and Human Science.