Thermomechanical and Fatigue Behavior of High-Temperature Lead and Lead-Free Solder Joints
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Edward Chan-Jiun Jih | R. K. Govila | Y. Pao | E. Jih | Scott J. Badgley | Y-H Pao | R. Govila | S. Badgley
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Edward Chan-Jiun Jih | R. K. Govila | Y. Pao | E. Jih | Scott J. Badgley | Y-H Pao | R. Govila | S. Badgley