Processes and stress under launching devices of a circuit integrated

The present invention relates to a particular device (2) placed under stress of an integrated circuit (1) comprising an electronic chip (10) mounted in a housing (12), said apparatus comprising a source (20) of thermal stress . The device (2) also comprises a member (22) coupling thermally conductive, to be thermally coupled to the source (20) of thermal stress during straining. The member (22) comprises a coupling end (220) of shape adapted to be inserted in a predetermined opening geometry to achieve in the housing (12) of the integrated circuit (1) so as to thermally couple a coupling face ( 222) of said end (220) with a face (102) of the chip (10).