Design, processing and reliability characterizations of a 3D-WLCSP packaged component

Market demand is increasing for even higher packaging densities, smaller size, lower cost, and more heterogeneous functionality. As a result, three dimensional (3D) packaging has emerged as a leading packaging solution. This paper introduces a 3D Wafer Level CSP packaging architecture that provides a cost effective, rapid time to market alternative to emerging 3D die to wafer integration technologies.

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