论文信息 - A closed form solution of junction to substrate thermal resistance in semiconductor chips

A closed form solution of junction to substrate thermal resistance in semiconductor chips

The model presented in this work is based on an extension of the constant angle heat spreading, taking into account chip and substrate dimensions, and changing the spreading angle accordingly. This yields to closed form expressions accurate enough for most practical applications. Circular, square, and rectangular geometries have been analyzed and the results compared with Bessel and Fourier series-like solutions.

F. N. Masana | F. Masana

[1] A. Bar-Cohen,et al. Theta /sub JC/ characterization of chip packages-justification, limitations, and future , 1989, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[2] A. L. Palisoc,et al. Thermal analysis of integrated circuit devices and packages , 1989 .

[3] Peter Sandborn,et al. Conceptual design of multichip modules and systems , 1994 .

[4] David P. Kennedy,et al. Spreading Resistance in Cylindrical Semiconductor Devices , 1960 .

[5] M. Kohara,et al. High Thermal Conduction Package Technology for Flip Chip Devices , 1983 .

[6] D. Waller,et al. Analysis of Surface Mount Thermal and Thermal Stress Performance , 1983 .

[7] R. David,et al. Computerized Thermal Analysis of Hybrid Circuits , 1977 .

[8] M. Adlerstein,et al. Approximate formulas for the thermal resistance of IMPATT diodes compared with computer calculations , 1977, IEEE Transactions on Electron Devices.

[9] R. D. Lindsted,et al. Steady-state junction temperatures of semiconductor chips , 1972 .

[10] L. Mahalingam,et al. Thermal Studies on Pin Grid Array Packages for High Density LSI and VLSI Logic Circuits , 1983 .

[11] Darvin R. Edwards,et al. Thermal enhancement of plastic IC packages , 1995 .

[12] A. L. Palisoc,et al. A general integration algorithm for the inverse Fourier transform of four-layer infinite plate structures , 1989 .