Realization of a commercial 10 Gbit/s TDM transmission system

Future 10 Gbit/s-TDM systems demand high-speed circuits with a high level of integration in order to be reliable and cost-effective. The building blocks of a 10 Gbit/s-system and a four-part chip-set (16:1 multiplexer, laser-/modulator-driver, AGC-amplifier, 1:16 demultiplexer) are described. The results show the suitability of Si-bipolar technologies for this data rate.