On the equivalence between cylindrical and rectangular via-holes in electromagnetic modeling
暂无分享,去创建一个
[1] W. Heinrich,et al. Via arrays for grounding in multilayer packaging - frequency limits and design rules , 2003, IEEE MTT-S International Microwave Symposium Digest, 2003.
[2] Mauro Mongiardo,et al. Analysis of packaged microwave integrated circuits by FDTD , 1994 .
[3] F. Alessandri,et al. Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching technique , 1992 .
[4] Dongsoo Koh,et al. A hybrid full-wave analysis of via hole grounds using finite difference and finite element time domain methods , 1997, IMS 1997.
[5] The perfectly matched layer as lateral boundary in finite-difference transmission-line analysis , 2000, IMS 2000.
[6] A. Ziroff,et al. A novel approach for LTCC packaging using a PBG structure for shielding and package mode suppression , 2003, 33rd European Microwave Conference Proceedings (IEEE Cat. No.03EX723C).
[7] Kyutae Lim,et al. Development of Highly Integrated 3D Microwave - Millimeter Wave Radio Front-End System-on-Package (SOP) , 2001 .
[8] P Thoma,et al. A subgridding method in combination with the finite integration technique , 1995, 1995 25th European Microwave Conference.
[9] Ruey-Beei Wu,et al. Full-wave characterization of a through hole via in multi-layered packaging , 1995 .
[10] R. H. Jansen. A full-wave electromagnetic model of cylindrical and conical via hole grounds for use in interactive MIC/MMIC design , 1992, 1992 IEEE Microwave Symposium Digest MTT-S.