Application of low-Reynolds number turbulent flow models to the prediction of electronic component heat transfer

The turbulent flow modeling capabilities of Computational Fluid Dynamics (CFD) codes dedicated to the thermal analysis of electronic equipment are typically constrained to zero-equation mixing length and standard two-equation high-Reynolds number k-e eddy viscosity models. Recent publications have highlighted their potential shortcomings for the prediction of electronic component heat transfer. Using experimental benchmarks, this study investigates the performance of alternative, low-Reynolds number eddy viscosity turbulent flow modeling strategies. Significant improvements in component operating temperature prediction accuracy are obtained relative to the standard high-Reynolds number k-e model. For the test configurations considered, improved predictive accuracy is attributed to the greater suitability of the near-wall turbulence modeling employed for the prediction of heat transfer in reattaching or separating flow conditions, as compared to turbulence models relying on wall functions. Such improvements would enable parametric analysis of product thermal performance to be undertaken with greater confidence, and contribute to the generation of more accurate temperature boundary conditions for electronics reliability assessment. This could ultimately help reduce the current dependency on experimental prototyping. The case is made for vendors of CFD codes dedicated to the thermal analysis of electronics to consider the adoption of eddy viscosity turbulence models more suited to detailed board-level analysis than the standard high-Reynolds number k-e model.

[1]  Scott E. LeClaire.  The Effects of Secondary Flows on the Convective Heat Transfer from a Heated Block in an Airstream , 1997 .

[2]  Joel H. Ferziger,et al.  Computational methods for fluid dynamics , 1996 .

[3]  Johan Meyers,et al.  Flow modeling in air-cooled electronic enclosures , 2003, Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003..

[4]  Michael Yang,et al.  A comparison of using icepak and flotherm in electronic cooling , 2000, ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069).

[5]  Walter Tollmien,et al.  Über die ausgebildete Turbulenz , 1961 .

[6]  C. Lasance,et al.  Thermal Management of Air-Cooled Electronic Systems: New Challenges for Research , 1994 .

[7]  John Lohan,et al.  A benchmark study of computational fluid dynamics predictive accuracy for component-printed circuit board heat transfer , 2000 .

[8]  V. C. Patel,et al.  Near-wall turbulence models for complex flows including separation , 1988 .

[9]  Peter Rodgers,et al.  An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature , 2003 .

[10]  H. I. Rosten,et al.  Development, validation and application of a thermal model of a plastic quad flat pack , 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

[11]  Valerie Eveloy,et al.  An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling , 2003 .

[12]  Ann M. Anderson.  A Comparison of Computational and Experimental Results for Flow and Heat Transfer From an Array of Heated Blocks , 1997 .

[13]  B. Launder,et al.  Mathematical Models of turbulence , 1972 .

[14]  Jukka Rantala,et al.  Enhanced electronic system reliability - challenges for temperature prediction , 2002 .

[15]  Wolfgang Rodi,et al.  Experience with two-layer models combining the k-epsilon model with a one-equation model near the wall , 1991 .

[16]  C.J.M. Lasance.  The conceivable accuracy of experimental and numerical thermal analyses of electronic systems , 2002 .

[17]  F. Menter.  Two-equation eddy-viscosity turbulence models for engineering applications , 1994 .

[18]  Sanjay R. Mathur,et al.  A Reynolds-averaged Navier-Stokes solver using unstructured mesh-based finite-volume scheme , 1998 .

[19]  B. Launder,et al.  The numerical computation of turbulent flows , 1990 .

[20]  W. Nakayama,et al.  CFD simulations of heat transfer from a heated module in an air stream: Comparison with experiments and a parametric study , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

[21]  Andrew Pollard,et al.  Heat transfer in separated and impinging turbulent flows , 1996 .

[22]  B. A. Zahn.  Evaluating thermal characterization accuracy using CFD codes-a package level benchmark study of IcePak/sup TM/ and Flotherm/sup R/ , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

[23]  B. Launder,et al.  Application of the energy-dissipation model of turbulence to the calculation of flow near a spinning disc , 1974 .

[24]  Clemens J. M. Lasance.  The European project PROFIT: prediction of temperature gradients influencing the quality of electronic products , 2001, Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189).

[25]  Dereje Agonafer,et al.  Numerical Modeling of Forced Convection Heat Transfer for Modules Mounted on Circuit Boards , 1989 .

[26]  G. Raithby,et al.  COMPUTATION OF RADIANT HEAT TRANSFER ON A NONORTHOGONAL MESH USING THE FINITE-VOLUME METHOD , 1993 .

[27]  Vincent P. Manno,et al.  Achieving accurate thermal characterization using a CFD code: a case study of PLCC packages , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[28]  Klaus Bremhorst,et al.  A Modified Form of the k-ε Model for Predicting Wall Turbulence , 1981 .

[29]  J. Murthy,et al.  A PRESSURE-BASED METHOD FOR UNSTRUCTURED MESHES , 1997 .

[30]  Ken-ichi Abe,et al.  A new turbulence model for predicting fluid flow and heat transfer in separating and reattaching flows—I. Flow field calculations , 1995 .

[31]  E. Meinders.  Experimental study of heat transfer in turbulent flows over wall-mounted cubes. , 1998 .

[32]  J. Lohan,et al.  Comparison of numerical predictions and experimental measurements for the transient thermal behavior of a board-mounted electronic component , 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

[33]  Valerie Eveloy,et al.  An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion , 2003 .

[34]  Peter Rodgers,et al.  Application of Experimental Airflow Visualization Techniques to Aid the Numerical Modeling of Electronic Component Convective Heat Transfer , 2003 .

[35]  M.S.J. Hashmi,et al.  Numerical prediction of electronic component operational temperature: a perspective , 2004, IEEE Transactions on Components and Packaging Technologies.

[36]  T. Shih,et al.  New time scale based k-epsilon model for near-wall turbulence , 1993 .