Wafer level image sensor packaging method Bsi

The present invention discloses a BSI image sensor wafer level package, the method comprising: performing a first cutting of BSI image sensor wafer package through a first cutting blade, interconnecting adjacent BSI image sensors separated layer; a second cutter by BSI image sensor wafer to package a second cut, to obtain a plurality of individual BSI image sensor; wherein the first stiffness is greater than the second cutter blade. Compared with the prior art, wafer level packaging method of BSI image sensor of the present invention effectively improve the performance and reliability of BSI image sensor package obtained after.