Development of high accuracy wafer thinning and pickup technology for thin wafer(die)

Accurate wafer thinning and picking up die technology around 10μm thickness were evaluated. We obtained the prospect that thickness accuracy 10±1μm which is the target of the ultra thin grinding, by applying new technology like Non-contact gauge or Auto TTV. For picking up the ultra thin dies, we found the best tool design rule and some machine condition in slider peel method.