论文信息 - Characterization and modeling of RF substrate coupling effects in 3D integrated circuit stacking - 字舞流文

Characterization and modeling of RF substrate coupling effects in 3D integrated circuit stacking

P. Leduc | A. Farcy | T. Lacrevaz | C. Bermond | B. Fléchet | F. Calmon | P. Ancey | L. Cadix | S. Capraro | O. Valorge | J. Roullard | E. Eid