A fast 3D modeling approach to electrical parameters extraction of bonding wires for RF circuits
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Xiaoning Qi | T. Arnborg | Robert W. Dutton | P. Yue | Hyongsok T. Soh | H. Sakai | Zhiping Yu | Zhiping Yu | H. Soh | X. Qi | P. Yue | T. Arnborg | C. Yue | H. Sakai | R. Dutton | H. Sakai
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