A novel MEMS silicon probe card

We have developed a novel cantilever-type probe which is capable of less than 70 of pitch and 12g of force. This probe is suitable for wafer-level burn-in testing, function testing and circuit-board O/S testing including memory and RF devices. The probe was fabricated with epitaxial polysilicon on silicon substrate. The through via hole interconnection was formed in silicon wafer by nickel electroless plating and copper electroplating. The electroless plating is easy method and can deposit film uniformly for deep trench and through hole. Especially, it can deposit film on any substrates without seed layer and allow it to be electroplated. The aspect ratio of through via hole was larger than 10:1 and the contact resistance was less than 1 ohm.

[1]  R. B. Marcus,et al.  Thermally actuated microprobes for a new wafer probe card , 1999 .

[2]  Yong-Soo Oh,et al.  A vacuum packaged differential resonant accelerometer using gap sensitive electrostatic stiffness changing effect , 2000, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308).

[3]  T. Ono,et al.  Fabrication of microprobe array with sub-100 nm nano-heater for nanometric thermal imaging and data storage , 2001, Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090).

[4]  S. Wong,et al.  Ultra-Low Resistance, Through-Wafer Via (TWV) Technology and Its Applications in Three Dimensional Structures on Silicon , 1998 .

[5]  R. Dennis Bates.  The search for the universal probe card solution , 1997, Proceedings International Test Conference 1997.

[6]  Tadatomo Suga,et al.  Characteristics of Low Force Contact Process for MEMS Probe Cards , 2002 .

[7]  T. Kenny,et al.  Low Force Electrical Contact Measurements Using Piezoresistive MEMS Cantilevers to Characterize Thin-Film Metallization , 2001 .

[8]  M. Beiley,et al.  A micromachined array probe card-fabrication process , 1995 .

[9]  H. Baltes,et al.  Fabrication technology for wafer through-hole interconnections and three-dimensional stacks of chips and wafers , 1994, Proceedings IEEE Micro Electro Mechanical Systems An Investigation of Micro Structures, Sensors, Actuators, Machines and Robotic Systems.