Characterisation of the HEXITEC4S X-ray spectroscopic imaging detector incorporating through-silicon via (TSV) technology
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A. Lozinskaya | O. Tolbanov | A. Tyazhev | A. Zarubin | M. Veale | P. Seller | L. Jones | I. Church | A. Schneider | P. Booker | J. Lipp | V. Novikov | I. Kolesnikova | M. Wilson | I. Chsherbakov
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