Dry etching-based silicon micro-machining for MEMS

Abstract The aim of this work is to demonstrate the “dry” etching-based micro-fabrication technologies in the manufacturing of single-crystal silicon for micro-electro/(optical)-mechanical-systems (ME(O)MS). The ME(O)MS technology is a very fast-growing industry based often on the same silicon technology as integrated circuits. The process of plasma dry etching is quite simple straightforward and can be considered as the key technology in the micro-machining of silicon. The most important motivation for this work is advancement of the micro-machining industry. The basic aspects of pattern transfer of the prepared resist-patterns by plasma etching into the substrate, considering plasma chemistry, gas flow or gas chopping, and substrate temperature will be presented. Special attention will be given to discuss the physical and chemical phenomena which are involved in the generation of features with high aspect ratios.