The study on failure mechanisms of bond pad metal peeling: Part B--Numerical analysis
暂无分享,去创建一个
[1] Insu Jeon,et al. The role of higher order eigenfields in elastic–plastic cracks , 2001 .
[2] A. Charlesby. CRC materials science and engineering handbook , 1997 .
[3] M. Mahaney,et al. The bond shear test: an application for the reduction of common causes of gold ball bond process variation , 1992, 30th Annual Proceedings Reliability Physics 1992.
[4] Leroy S. Fletcher,et al. Contact heat transfer: the last decade , 1986 .
[5] Y. Takahashi,et al. Numerical analysis of the interfacial contact process in wire thermocompression bonding , 1996 .
[6] Ampere A. Tseng,et al. Thermal Modeling of Roll and Strip Interface in Rolling Processes: Part 1-REVIEW , 1999 .
[7] Cher Ming Tan,et al. Failure analysis of bond pad metal peeling using FIB and AFM , 1998, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A.
[8] B. Mikic,et al. THERMAL CONTACT CONDUCTANCE; THEORETICAL CONSIDERATIONS , 1974 .
[9] Insu Jeon,et al. The study on failure mechanisms of bond pad metal peeling: Part A--Experimental investigation , 2003, Microelectron. Reliab..
[10] Cher Ming Tan,et al. Effect of BOE etching time on wire bonding quality , 1999 .
[11] K. Inoue,et al. Numerical analysis of fine lead bonding-effect of pad mechanical properties on interfacial deformation , 1999 .
[12] Fred G. Kuper,et al. A concept to relate wire bonding parameters to bondability and ball bond reliability , 1998 .
[13] N. Chidambaram,et al. A numerical and experimental study of temperature cycle wire bond failure , 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.
[14] W. K. Shu,et al. Fine pitch wire bonding development using statistical design of experiment , 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.
[15] M. Cooper,et al. Thermal contact conductance , 1969 .
[16] Bart Vandevelde,et al. A generic methodology for deriving compact dynamic thermal models, applied to the PSGA package , 1998, IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A.
[17] Ampere A. Tseng. THERMAL MODELING OF ROLL AND STRIP INTERFACE IN ROLLING PROCESSES: PART 2-SIMULATION , 1999 .
[18] D. F. Miner,et al. Handbook of engineering materials , 1955 .
[19] S. J. Hu,et al. Study of temperature parameter on the thermosonic gold wire bonding of high-speed CMOS , 1991 .
[20] Byung Man Kwak,et al. Formulation of thermo-mechanical frictional contact based on complementarity relations , 1994 .
[21] J. Rice,et al. Finite-element formulations for problems of large elastic-plastic deformation , 1975 .
[22] K. Inoue,et al. Numerical analysis of fine lead bonding-effect of pad thickness on interfacial deformation , 1999 .
[23] Li Shi,et al. Finite‐element stress analysis of failure mechanisms in a multilevel metallization structure , 1995 .