Self-Reducing Copper Precursor Inks and Photonic Additive Yield Conductive Patterns under Intense Pulsed Light

Printing conducting copper interconnections on plastic substrates is of growing interest in the field of printed electronics. Photonic curing of copper inks with intense pulsed light (IPL) is a promising process as it is very fast and thus can be incorporated in roll-to-roll production. We report on using IPL for obtaining conductive patterns from inks composed of submicron particles of copper formate, a copper precursor that has a self-reduction property. Decomposition of copper formate can be performed by IPL and is affected both by the mode of energy application and the properties of the printed precursor layer. The energy application mode was controlled by altering three pulse parameters: duration, intensity, and repetitions at 1 Hz. As the decomposition results from energy transfer via light absorption, carbon nanotubes (CNTs) were added to the ink to increase the absorbance. We show that there is a strict set of IPL parameters necessary to obtain conductive copper patterns. Finally, we show that by adding as little as 0.5 wt % single-wall CNTs to the ink the absorptance was enhanced by about 50% and the threshold energy required to obtain a conductive pattern decreased by ∼25%. These results have major implications for tailoring inks intended for IPL processing.

[1]  S. Ko,et al.  One-Step Fabrication of Copper Electrode by Laser-Induced Direct Local Reduction and Agglomeration of Copper Oxide Nanoparticle , 2011 .

[2]  S. Magdassi,et al.  Wet deposition of carbon nanotube black coatings for stray light reduction in optical systems , 2015 .

[3]  A. Kell,et al.  Photosintering and electrical performance of CuO nanoparticle inks , 2014 .

[4]  K. Schroder.  Mechanisms of Photonic Curing™: Processing High Temperature Films on Low Temperature Substrates , 2011 .

[5]  Hak-Sung Kim,et al.  Copper Nanoparticle/Multiwalled Carbon Nanotube Composite Films with High Electrical Conductivity and Fatigue Resistance Fabricated via Flash Light Sintering. , 2015, ACS applied materials & interfaces.

[6]  Hyun-Jun Hwang,et al.  In situ monitoring of flash-light sintering of copper nanoparticle ink for printed electronics , 2012, Nanotechnology.

[7]  Changhong Liu,et al.  A Solar Thermoelectric Conversion Material Based on Bi2Te3 and Carbon Nanotube Composites , 2014 .

[8]  Lianbin Zhang,et al.  Self-Floating Carbon Nanotube Membrane on Macroporous Silica Substrate for Highly Efficient Solar-Driven Interfacial Water Evaporation , 2016 .

[9]  S. Ko,et al.  Maskless Fabrication of Highly Robust, Flexible Transparent Cu Conductor by Random Crack Network Assisted Cu Nanoparticle Patterning and Laser Sintering , 2016 .

[10]  Ulrich S Schubert,et al.  Roll‐to‐Roll Compatible Sintering of Inkjet Printed Features by Photonic and Microwave Exposure: From Non‐Conductive Ink to 40% Bulk Silver Conductivity in Less Than 15 Seconds , 2012, Advanced materials.

[11]  K. Shinozaki,et al.  Cu salt ink formulation for printed electronics using photonic sintering. , 2013, Langmuir : the ACS journal of surfaces and colloids.

[12]  S. Magdassi,et al.  Formation and performance of highly absorbing solar thermal coating based on carbon nanotubes and boehmite , 2016 .

[13]  S. Magdassi,et al.  Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics. , 2015, Chemical communications.

[14]  A. Galwey,et al.  Thermal decomposition of three crystalline modifications of anhydrous copper(II) formate , 1974 .

[15]  A. Martucci,et al.  Photonic Sintering of Copper through the Controlled Reduction of Printed CuO Nanocrystals. , 2015, ACS applied materials & interfaces.

[16]  Hak-Sung Kim,et al.  Flash light sintered copper precursor/nanoparticle pattern with high electrical conductivity and low porosity for printed electronics , 2015 .

[17]  Hyunmin Cho,et al.  Low-Temperature Oxidation-Free Selective Laser Sintering of Cu Nanoparticle Paste on a Polymer Substrate for the Flexible Touch Panel Applications. , 2016, ACS applied materials & interfaces.

[18]  S. Magdassi,et al.  Printing a Self‐Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity , 2015 .

[19]  Matti Mäntysalo,et al.  Comparison of laser and intense pulsed light sintering (IPL) for inkjet-printed copper nanoparticle layers , 2015, Scientific Reports.

[20]  S. B. Krupanidhi,et al.  Carbon Nanotube‐Based Tandem Absorber with Tunable Spectral Selectivity: Transition from Near‐Perfect Blackbody Absorber to Solar Selective Absorber , 2014, Advanced materials.

[21]  Seung Hwan Ko,et al.  Fast Plasmonic Laser Nanowelding for a Cu‐Nanowire Percolation Network for Flexible Transparent Conductors and Stretchable Electronics , 2014, Advanced materials.

[22]  Hak-Sung Kim,et al.  Flash light sintering of nickel nanoparticles for printed electronics , 2014 .

[23]  S. Magdassi,et al.  Fabrication of Carbon Nanotube/Indium Tin Oxide “Inverse Tandem” Absorbing Coatings with Tunable Spectral Selectivity for Solar–Thermal Applications , 2015 .

[24]  Yong-Won Song,et al.  Cu ion ink for a flexible substrate and highly conductive patterning by intensive pulsed light sintering. , 2013, ACS applied materials & interfaces.

[25]  J. Creighton,et al.  Ultraviolet–visible absorption spectra of the colloidal metallic elements , 1991 .

[26]  Sung-Hyeon Park,et al.  A highly reliable copper nanowire/nanoparticle ink pattern with high conductivity on flexible substrate prepared via a flash light-sintering technique. , 2015, ACS applied materials & interfaces.

[27]  Nigel Fox,et al.  The partial space qualification of a vertically aligned carbon nanotube coating on aluminium substrates for EO applications. , 2014, Optics express.

[28]  Thad Druffel,et al.  Fabrication of Elemental Copper by Intense Pulsed Light Processing of a Copper Nitrate Hydroxide Ink. , 2015, ACS applied materials & interfaces.