Equivalent circuit model of through-silicon-via in slow wave mode
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[1] Yinshui Xia,et al. Study on Transmission Characteristics of Carbon Nanotube Through Silicon Via Interconnect , 2014, IEEE Microwave and Wireless Components Letters.
[2] Yintang Yang,et al. Electrical Modeling and Characterization of Shield Differential Through-Silicon Vias , 2015, IEEE Transactions on Electron Devices.
[3] H. Reichl,et al. High-Frequency Modeling of TSVs for 3-D Chip Integration and Silicon Interposers Considering Skin-Effect, Dielectric Quasi-TEM and Slow-Wave Modes , 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[4] Yintang Yang,et al. Effectiveness of $p +$ Layer in Mitigating Substrate Noise Induced by Through-Silicon Via for Microwave Applications , 2016, IEEE Microwave and Wireless Components Letters.
[5] Yintang Yang,et al. New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs) , 2016, IEICE Electron. Express.
[6] Yintang Yang,et al. Universal closed-form expressions for the inductance of tapered through silicon vias (T-TSVs) based on vector magnetic potential , 2016, IEICE Electron. Express.
[7] Yangyang Yan,et al. Electrical Characterization of Coaxial Silicon–Insulator–Silicon Through-Silicon Vias: Theoretical Analysis and Experiments , 2016, IEEE Transactions on Electron Devices.
[8] Fengjuan Wang,et al. Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon , 2015, IEICE Electron. Express.
[9] Joungho Kim,et al. Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis , 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[10] Fengjuan Wang,et al. Explicit model of thermal stress induced by annular through-silicon-via (TSV) , 2016, IEICE Electron. Express.
[11] Yintang Yang,et al. Metal Proportion Optimization of Annular Through-Silicon via Considering Temperature and Keep-Out Zone , 2015, IEEE Transactions on Components, Packaging and Manufacturing Technology.