A Model of BGA Thermal Fatigue Life Prediction Considering Load Sequence Effects

Accurate testing history data is necessary for all fatigue life prediction approaches, but such data is always deficient especially for the microelectronic devices. Additionally, the sequence of the individual load cycle plays an important role in physical fatigue damage. However, most of the existing models based on the linear damage accumulation rule ignore the sequence effects. This paper proposes a thermal fatigue life prediction model for ball grid array (BGA) packages to take into consideration the load sequence effects. For the purpose of improving the availability and accessibility of testing data, a new failure criterion is discussed and verified by simulation and experimentation. The consequences for the fatigue underlying sequence load conditions are shown.

[1]  S. Suresh.  Fatigue of materials , 1991 .

[2]  Yanchun Zhou,et al.  Assessing the elastic parameters and energy-dissipation capacity of solid materials: A residual indent may tell all , 2005 .

[3]  Zhaowei Zhong,et al.  Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact , 2006, IEEE Transactions on Components and Packaging Technologies.

[4]  Hong Tang,et al.  Experimental characterization of material degradation of solder joint under fatigue loading , 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

[5]  S. Manson,et al.  Treatment of multiaxial creep-fatigue by strainrange partitioning , 1976 .

[6]  R. Ghaffarian.  Effect of Area Array Package Types on Assembly Reliability And Comments on IPC-9701A , 2005 .

[7]  M. Vormwald.  Fatigue Crack Propagation under Large Cyclic Plastic Strain Conditions , 2014 .

[8]  Robert Darveaux,et al.  Crack initiation and growth in WLCSP solder joints , 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

[9]  B. Rodgers,et al.  Finite element modelling of a BGA package subjected to thermal and power cycling , 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

[10]  P. Lall,et al.  Assessment of Accrued Damage and Remaining Useful Life in Leadfree Electronics Subjected to Multiple Thermal Environments of Thermal Aging and Thermal Cycling , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[11]  Linlin Yang,et al.  Effects of microstructure evolution on damage accumulation in lead-free solder joints , 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

[12]  J. Pang,et al.  Lead-free 95.5Sn-3.8Ag-0.7Cu solder joint reliability analysis for micro-BGA assembly , 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

[13]  Michael Vormwald,et al.  Classification of Load Sequence Effects in Metallic Structures , 2015 .

[14]  Yoshiharu Mutoh,et al.  Fatigue crack growth behavior of Sn–Pb and Sn-based lead-free solders , 2003 .

[15]  Guna S Selvaduray,et al.  Solder joint fatigue models: review and applicability to chip scale packages , 2000 .

[16]  Investigation in biaxial-stress effect on mode I fracture resistance of brittle materials by FEM simulation and K–G–J–δ relationship , 2005 .

[17]  Peter Borgesen,et al.  On the Assessment of the Life of SnAgCu Solder Joints in Cycling With Varying Amplitudes , 2013, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[18]  Abhishek K Gupta,et al.  Numerical Methods using MATLAB , 2014, Apress.

[19]  Myung K. Kim,et al.  Bottom leaded plastic (BLP) package: a new design with enhanced solder joint reliability , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[20]  John H. Lau,et al.  Chip scale package (CSP) : design, materials, processes, reliability, and applications , 1999 .

[21]  Wenjie Wang,et al.  Quantification of creep strain in small lead-free solder joints with the in-situ micro electronic-resistance measurement , 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

[22]  Ali Fatemi,et al.  Cumulative fatigue damage and life prediction theories: a survey of the state of the art for homogeneous materials , 1998 .

[23]  Chih-Kuang Lin,et al.  Creep properties of Sn-3.5Ag-0.5Cu lead-free solder under step-loading , 2006 .

[24]  B. A. Fiedler,et al.  Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance , 2012 .