Pattern uniformity control in integrated structures
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Carlos Fonseca | Satoru Shimura | Shinji Kobayashi | Serge Biesemans | Kathleen Nafus | Masashi Enomoto | Soichiro Okada
[1] Hengpeng Wu,et al. Patterning sub-25nm half-pitch hexagonal arrays of contact holes with chemo-epitaxial DSA guided by ArFi pre-patterns , 2015, Advanced Lithography.
[2] Ken Maruyama,et al. Novel EUV Resist Materials and Process for 20 nm Half Pitch and Beyond , 2013 .
[3] Akiteru Ko,et al. Resist process applications to improve EUV patterning , 2013, Advanced Lithography.
[4] Gijsbert Rispens,et al. Influence of etch process on contact hole local critical dimension uniformity in extreme-ultraviolet lithography , 2015, Advanced Lithography.
[5] Jan Mulkens,et al. Overlay and edge placement control strategies for the 7nm node using EUV and ArF lithography , 2015, Advanced Lithography.
[6] Jan V. Hermans,et al. Towards manufacturing a 10nm node device with complementary EUV lithography , 2013, Advanced Lithography.
[7] Yi Cao,et al. Using chemo-epitaxial directed self-assembly for repair and frequency multiplication of EUVL contact-hole patterns , 2014, Advanced Lithography.
[8] Carlos Fonseca,et al. Analyzing block placement errors in SADP patterning , 2016, SPIE Advanced Lithography.
[9] Warren Montgomery,et al. Evaluation of novel processing approaches to improve extreme ultraviolet (EUV) photoresist pattern quality , 2015, Advanced Lithography.
[10] G. de Boer,et al. MAPPER: progress toward a high-volume manufacturing system , 2013, Advanced Lithography.
[11] Makoto Muramatsu,et al. Simulation analysis of directed self-assembly for hole multiplication in guide pattern , 2014, Advanced Lithography.
[12] Hiroyuki Shindo,et al. Contour-based metrology for complex 2D shaped patterns printed by multiple-patterning process , 2014, Advanced Lithography.
[13] Yijian Chen,et al. A generalized edge-placement yield model for the cut-hole patterning process , 2014, Advanced Lithography.
[14] Seo Min Kim,et al. EUV stochastic noise analysis and LCDU mitigation by etching on dense contact-hole array patterns , 2014, Advanced Lithography.
[15] Guido Schiffelers,et al. EUV lithography: NXE platform performance overview , 2014, Advanced Lithography.
[16] Franklin M. Schellenberg,et al. Phase aware proximity correction for advanced masks , 2000, Advanced Lithography.
[17] Jacek K. Tyminski. Single lithography exposure edge placement model , 2015, Advanced Lithography.
[18] Keita Katou,et al. High volume manufacturing capability of negative tone development process , 2011, Advanced Lithography.
[19] Nima Kalhor,et al. Impact of pixel-dose optimization on pattern fidelity for helium ion beam lithography on EUV resist , 2015, Advanced Lithography.
[20] James Cameron,et al. Understanding EUV resist mottling leading to better resolution and linewidth roughness , 2014, Advanced Lithography.
[21] Makoto Shimizu,et al. Key parameters of EUV resists for contact hole applications , 2012, Advanced Lithography.
[22] Dominic Ashworth,et al. SEMATECH's cycles of learning test for EUV photoresist and its applications for process improvement , 2014, Advanced Lithography.