论文信息 - A Reduced Order Modeling Framework for Thermal Modeling of Shipboard Power Electronics Cabinets

A Reduced Order Modeling Framework for Thermal Modeling of Shipboard Power Electronics Cabinets

A system-level thermal modeling methodology for shipboard power-electronics cabinets is presented and demonstrated for two complex air-to-water-cooled cabinet designs of interest to naval applications (PCM-1 and PCM-2). Both cabinet designs are completely sealed and the heat dissipated in the power electronics bays is removed from the cabinet by re-circulating the hot air through an air-to-water-cooled packaged heat exchanger that is served by an external fresh water loop. The detailed unit-wise analytical compact model of the packaged heat exchanger used in the cabinet is fairly general. Under the prescribed design parameters, the PCM-2 cabinet operating-point air circulation rate was established to be 0.392 m 3 /s (830 CFM). A compact model for the air convection within the cabinet is developed using 3-D Computational Fluid Dynamics/Heat Transfer (CFD/HT) simulations, in conjunction with Proper Orthogonal Decomposition (POD) based reduced order modeling techniques. The compact model runs about 350 times faster with mean prediction error within 13% for the velocity field, and within 0.2% for the temperature and pressure fields. It can be integrated into a system-level modeling platform to simulate the thermal response of multiple cabinets for both design and rating purposes. The CFD/HT simulations of the PCM-2 cabinet architecture suggest that its two uppermost bays would experience high air temperatures due to insufficient local air flow. Nomenclature ak,bk Modal weight coefficients

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