Effect of Hydrogen Peroxide on Oxidation of Copper in CMP Slurries Containing Glycine
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Ling Wang | Fiona M. Doyle | F. M. Doyle | Ling Wang | Serdar Aksu | S. Aksu | F. Doyle
[1] M. E. Gross,et al. RECRYSTALLIZATION KINETICS OF ELECTROPLATED CU IN DAMASCENE TRENCHES AT ROOM TEMPERATURE , 1998 .
[2] S. Babu,et al. Mechanism of Cu removal during CMP in H 2 O 2 -glycine based slurries , 1999 .
[3] R. C. Weast. CRC Handbook of Chemistry and Physics , 1973 .
[4] K. K. Mishra,et al. Solution chemical constraints in the chemical-mechanical polishing of copper: Aqueous stability diagrams for the Cu-H2O and Cu-NH3-H2O systems , 1996 .
[5] S. Babu,et al. Chemical–mechanical polishing of copper in alkaline media , 1997 .
[6] Ronald A. Carpio,et al. Initial study on copper CMP slurry chemistries , 1995 .
[7] Gottlieb S. Oehrlein,et al. Surface Chemistry Studies of Copper Chemical Mechanical Planarization , 2001 .
[8] F. M. Doyle,et al. Electrochemistry of Copper in Aqueous Glycine Solutions , 2001 .
[9] P. G. Hill,et al. A Fundamental Equation of State for Heavy Water , 1982 .
[10] D. J. Pearson,et al. Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects , 1991 .
[11] J. Leja,et al. On the Potential/pH Diagrams of the Cu ‐ NH 3 ‐ H 2 O and Zn ‐ NH 3 ‐ H 2 O Systems , 1965 .
[12] M. Stern,et al. Electrochemical Polarization I . A Theoretical Analysis of the Shape of Polarization Curves , 1957 .
[13] M. Pourbaix. Atlas of Electrochemical Equilibria in Aqueous Solutions , 1974 .
[14] Ronald J. Gutmann,et al. Chemical Mechanical Planarization of Microelectronic Materials , 1997 .
[15] S. Babu,et al. Hydroxyl Radical Formation in H 2 O 2 ‐ Amino Acid Mixtures and Chemical Mechanical Polishing of Copper , 2000 .
[16] C. W. Jones,et al. Applications of Hydrogen Peroxide and Derivatives , 1999 .
[17] Fiona M. Doyle,et al. The Role of Glycine in the Chemical Mechanical Planarization of Copper , 2002 .