Thermal issues in next-generation integrated circuits
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S. Gurrum | S. Suman | Y. Joshi | A. Fedorov | A.G. Fedorov | Y.K. Joshi | S.P. Gurrum | S.K. Suman
[1] G. B. Kromann,et al. The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.
[2] Kaustav Banerjee,et al. Analysis and optimization of thermal issues in high-performance VLSI , 2001, ISPD '01.
[3] R. L. Webb,et al. Performance and testing of thermal interface materials , 2003, Microelectron. J..
[4] M. Maeda,et al. [Heat conduction]. , 1972, Kango kyoshitsu. [Nursing classroom].
[5] Yong-Seog Kim,et al. Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation , 1999 .
[6] Frank P. Incropera,et al. Fundamentals of Heat and Mass Transfer , 1981 .
[7] Yu‐Lin Shen. Analysis of Joule heating in multilevel interconnects , 1999 .
[8] K. Goodson,et al. Thermal conductance enhancement of particle-filled thermal interface materials using carbon nanotube inclusions , 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
[9] R. Viswanath. Thermal Performance Challenges from Silicon to Systems , 2000 .
[10] David Copeland. Fundamental performance limits of heatsinks , 2000 .
[11] K. Azar,et al. Experimental determination of thermal conductivity of printed wiring boards , 1996, Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings.
[12] A. Bar-Cohen,et al. Design and optimization of air-cooled heat sinks for sustainable development , 2002 .
[13] Jukka Rantala,et al. How well can we assess thermally driven reliability issues in electronic systems today? Summary of panel held at the Therminic 2002 , 2003, Microelectron. J..
[14] M. Yovanovich,et al. Spreading Resistance of Isoflux Rectangles and Strips on Compound Flux Channels , 1998 .
[15] Ravi Mahajan,et al. Critical Aspects of High-Performance Microprocessor Packaging , 2003 .
[16] B. M. Guenin,et al. Analysis of a thermally enhanced ball grid array package , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).