High voltage wiring using biased polysilicon field plates

Abstract This paper describes a technique for 800V wiring in a typical high voltage integrated circuit. Polysilicon field plates are biased using undoped poly resistors, connected in a voltage division scheme between the high voltage source and ground (A.F.J. Murray and W.A. Lane, Proc. 23rd European Solid State Device Research Conf. (ESSDERC'93), 1993, pp. 891–894). The field plates linearize the potential along the surface between the high voltage drain and the grounded isolation, and hence reduce the surface field at the isolation edge. 2D numerical simulation is used to illustrate the effect of spacing variation between the field plates and the 3D effect of a real wire. The inter-layer dielectric is also investigated using initial measured results.

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