2002 Index IEEE Transactions on Advanced Packaging Vol. 25

[1]  Wen-Bin Young,et al.  The effect of solder bump pitch on the underfill flow , 2002 .

[3]  Erping Li,et al.  Crosstalk and reflection for curvilinear conductors by utilizing a non-uniform transmission line approach , 2002, IEEE Transactions on Advanced Packaging.

[4]  S. Gupta,et al.  Validation and test issues related to noise induced by parasitic inductances of VLSI interconnects , 2002 .

[5]  Wei Pan,et al.  Half-conductive coupling interconnection technology for digital transmission between CMOS chips , 2002 .

[6]  Hai Lan,et al.  Accurate closed-form expressions for the frequency-dependent line parameters of on-chip interconnects on lossy silicon substrate , 2001, 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157).

[7]  Joungho Kim,et al.  Microwave frequency crosstalk model of redistribution line patterns on wafer level package , 2001 .

[8]  Yaomin Lin,et al.  Laser welding induced alignment distortion in butterfly laser module packages: effect of welding sequence , 2002 .

[9]  Todd H. Hubing,et al.  Reducing power bus impedance at resonance with lossy components , 2001 .

[10]  K. Neoh,et al.  Thermal and electroless deposition of copper on poly(tetrafluoroethylene-co-hexafluoropropylene) films modified by surface graft copolymerization , 2002 .

[11]  Joungho Kim,et al.  Microwave frequency interconnection line model of a wafer level package , 2002 .

[12]  Daniël De Zutter,et al.  Modelling complex via hole structures , 2001 .

[13]  S. Dvorak,et al.  Triangle impulse response (TIR) calculation for lossy transmission line simulation , 2001 .

[14]  Anestis Dounavis,et al.  A comparative study of two transient analysis algorithms for lossy transmission lines with frequency-dependent data , 2001 .

[15]  George E. Ponchak,et al.  Finite ground coplanar waveguide (FGC) low loss, low coupling 90-degree crossover junctions , 2002 .

[16]  P. Jain,et al.  Embedded thin film capacitors-theoretical limits , 2002 .

[17]  G. Servel,et al.  Inductance effect in crosstalk prediction , 2002 .

[18]  Madhavan Swaminathan,et al.  Modeling of multilayered power distribution planes using transmission matrix method , 2002 .

[19]  Kwang-Lung Lin,et al.  Effect of crystallinity and thickness on the diffusion barrier behavior of electroless nickel deposit between Cu and solder , 2002 .

[20]  J. L. Prince,et al.  Foreword contributions from the 10th topical meeting on electrical performance of electronic packaging , 2002 .

[21]  Albert E. Ruehli,et al.  Physically consistent transmission line models for high-speed interconnects in lossy dielectrics , 2001 .

[22]  Kyutae Lim,et al.  A compact LTCC-based Ku-band transmitter module , 2002 .

[23]  G. Lippens,et al.  Inductance extraction for packages with adaptive non-orthogonal ground plane meshing , 2002 .

[24]  H. Grabinski,et al.  Methodology for characterization of high-speed multi-conductor metal interconnections and evaluation of measurement errors , 2002 .

[25]  Michel Nakhla,et al.  Analysis of transmission line circuits using multi-dimensional model reduction techniques , 2001 .

[26]  G. Troster,et al.  MM-wave microstrip patch and slot antennas on low cost large area panel MCM-D substrates-a feasibility and performance study , 2002 .

[27]  K.-S. Choi,et al.  Computational parametric analyzes on the solder joint reliability of bottom leaded plastic (BLP) package , 2002 .

[28]  Joungho Kim,et al.  Unit cell approach to full-wave analysis of meander delay line using FDTD periodic structure modeling method , 2002 .

[29]  Weimin Shi,et al.  New efficient method of modeling electronics packages with layered power/ground planes , 2002 .

[30]  H. Kroger,et al.  Improving signal integrity in circuit boards by incorporating embedded edge terminations , 2002 .

[31]  J. Gourlay,et al.  Adaptive alignment packaging for 2-D arrays of free-space optical-interconnected optoelectronic systems , 2002 .

[32]  Eiji Oki,et al.  640-Gb/s high-speed ATM switching system based on 0.25-/spl mu/m CMOS, MCM-C, and optical WDM interconnection , 2002 .

[33]  Ching-Ping Wong,et al.  Study on underfill/solder adhesion in flip-chip encapsulation , 2002 .

[34]  Koji Matsui,et al.  Embedded TiNxOy thin-film resistors in a build-up CSP for 10 Gbps optical transmitter and receiver modules , 2002 .

[35]  Madhavan Swaminathan,et al.  Modeling and simulation of core switching noise for ASICs , 2002 .

[36]  F. Olyslager,et al.  Recovering lossy multiconductor transmission line parameters from impedance or scattering representations , 2001 .

[37]  S. Mondal,et al.  A novel assembling technique for fiber collimator arrays using UV-curable adhesives , 2002 .

[38]  Joong-Ho Kim,et al.  Simulation and design methodology for a 50-Gb/s multiplexer/demultiplexer package , 2002 .

[39]  Barry K. Gilbert,et al.  The use of laminate multichip modules for the packaging of 9-GHz digital multichip circuits , 2002 .

[40]  R. J. Yarema,et al.  Development of a high density pixel multichip module at Fermilab , 2002 .

[41]  Joungho Kim,et al.  Characterization of picosecond electric-pulse propagation on CPW components by transient near-field mapping , 2002 .

[42]  Sudipto Chakraborty,et al.  Integrated RF architectures in fully-organic SOP technology , 2002 .

[43]  Fang Yu,et al.  Stress analysis in silicon die under different types of mechanical loading by finite element method (FEM) , 2002 .

[44]  I. A. Maio,et al.  Parametric macromodels of digital I/O ports , 2002 .

[45]  D. Jessie,et al.  An X-band small outline leaded plastic package for MMIC applications , 2002 .

[46]  Myoung Joon Choi,et al.  A quasi three-dimensional distributed electromagnetic model for complex power distribution networks , 2002 .

[47]  M. Dagenais,et al.  Design and fabrication of thin film resistive heaters for hybrid optoelectronic packaging , 2002 .

[48]  Paul W. Coteus,et al.  Characterization and performance evaluation of differential shielded cables for multi-Gb/s data-rates , 2002 .

[49]  Giulio Antonini,et al.  Equivalent network synthesis for via holes discontinuities , 2002 .

[50]  M. Pecht,et al.  Thermal characteristics of glass-metal composition plasma display panels , 2002 .

[51]  류웅환,et al.  Over GHz low-power RF clock distribution for a multi-processor digital system = 다중 프로세서 디지털 시스템을 위한 기가헤르쯔급 RF 클럭 분배 , 2001 .

[52]  Istvan Novak,et al.  Distributed matched bypassing for board-level power distribution networks , 2002 .

[53]  L. Davis,et al.  Loss characteristics of high-/spl epsiv//sub r/ microstrip lines fabricated by an etchable thick-film on ceramic MCM technology , 2002 .

[54]  Leung Tsang,et al.  Multiple scattering among vias in lossy planar waveguides using SMCG method , 2002 .

[55]  Gerardo Aguirre,et al.  Methods to reduce radiation from split ground planes in RF and mixed signal packaging structures , 2002 .

[56]  Yu-Lung Lo,et al.  Packaging a fiber Bragg grating without preloading in a simple athermal bimaterial device , 2002 .

[57]  Yue Liu.  Heterogeneous integration of OE arrays with Si electronics and microoptics , 2002 .

[58]  J. L. Prince,et al.  A study of the fields associated with horizontal dipole sources in stripline circuits , 2002 .

[60]  Roland Frech,et al.  Frequency dependencies of power noise , 2002 .