Power Module Package and Method for Manufacturing the same

The present invention includes a heat dissipation plate for power module package and as it relates to a process for the preparation, are spaced apart from each other arranged first heat radiating plate and the second heat radiating plate; An insulating layer formed on the heat dissipation plate; Insulating layer formed on the metal layer; A semiconductor element mounted on the metal layer; And the metal layer of the first heat radiating plate side or the second heat radiating plate side of the lead spacer formed to connect the metal layer and the semiconductor element; including, and the semiconductor devices formed on the metal layer of the first heat radiating plate side to the second heat radiating plate semiconductor devices formed on the metal layer of the side is characterized in that arranged in a stacked form.