Using Via Stubs in Periodic Structures for Microwave Filter Design

This paper presents a novel form of microwave filter construction using vias (plated through holes) available in generic printed circuit boards as the main building block. It is demonstrated that for a certain arrangement of vias, the resonant behavior of via stubs can be used to create a low- or a high-pass filter using open- or short-circuited vias, respectively. These stubs are periodically cascaded, resembling an analogous implementation using transmission-line stub filters. It will be shown that such a via filter structure can achieve insertion loss lower than 0.1 dB and return loss of about -60 dB in the passband at GHz frequencies. Measurements, full-wave, and physics-based simulations are presented to verify this novel filter concept and to provide design guidelines in the frequency range from 1 to 20 GHz.

[1]  Jun Fan,et al.  Equivalent mixed-mode characteristic impedances for differential signal vias , 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.

[2]  Ke Wu,et al.  Accurate modeling, wave mechanisms, and design considerations of a substrate integrated waveguide , 2006, IEEE Transactions on Microwave Theory and Techniques.

[3]  Jun Fan,et al.  Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz , 2009, IEEE Transactions on Microwave Theory and Techniques.

[4]  M. Ando,et al.  Single-layer feed waveguide consisting of posts for plane TEM wave excitation in parallel plates , 1998 .

[5]  E. R. Pillai,et al.  Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling , 1997 .

[6]  C. Schuster,et al.  Double stub matching in multilayered printed circuit board using vias , 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

[7]  Jun Fan,et al.  Accuracy of Physics-Based Via Models for Simulation of Dense Via Arrays , 2012, IEEE Transactions on Electromagnetic Compatibility.

[8]  Che-Ming Hsu,et al.  Influence of via stubs with different terminations on time-domain transmission waveform and eye diagram in multilayer PCBs , 2012 .

[9]  H. Tohya,et al.  Resonance stub effect in a transition from a through via hole to a stripline in multilayer PCBs , 2003, IEEE Microwave and Wireless Components Letters.

[10]  Harlan Jr. Howe,et al.  Stripline Circuit Design , 1974 .

[11]  Jun Fan,et al.  Equivalent transmission-line model for vias connected to striplines in multilayer print circuit boards , 2010, 2010 IEEE International Symposium on Electromagnetic Compatibility.

[12]  James L. Drewniak,et al.  EMC ’ 09 / Kyoto Equivalent Characteristic Impedance and Propagation Constant for Multi-Layer Via Structures , 2009 .

[13]  Christian Schuster,et al.  Minimizing displacement return currents in multilayer via structures , 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems.

[14]  Xiaoxiong Gu,et al.  Impedance design for multi-layered vias , 2008, 2008 IEEE-EPEP Electrical Performance of Electronic Packaging.

[15]  Sang-Hoon Lee,et al.  Signal Integrity Improvements of a MEMS Probe Card Using Back-Drilling and Equalizing Techniques , 2011, IEEE Transactions on Instrumentation and Measurement.

[16]  C. Schuster,et al.  DesignCon 2006 Developing a “ Physical ” Model for Vias , 2005 .

[17]  Heinz-Dietrich Bruns,et al.  Application of Vias as Functional Elements in Microwave Coupling Structures , 2013, IEEE Transactions on Microwave Theory and Techniques.

[18]  Sung-Ho Joo,et al.  Resistively-Terminated Via-Stubs for Signal Integrity Improvement in the Semiconductor Test Board , 2007, 2007 Korea-Japan Microwave Conference.

[19]  Jaemin Shin,et al.  Comprehensive design guidance for PTH via stub in board-level high speed differential interconnects , 2010, 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC).

[20]  C. Bednarz,et al.  Exact Analytical Solution for the Via-Plate Capacitance in Multiple-Layer Structures , 2012, IEEE Transactions on Electromagnetic Compatibility.