Live demonstration: A 3D die-level integration platform

This paper presents a three-dimensional (3D) die-level integration platform, MorPACK. The structure of MorPACK is 3D stacked by the connection modules and circuit modules. It makes MorPACK platform own heterogeneous integration capabilities. With proper system partition and tri-state interface connection, the MorPACK system can be extended by the peripheral interfaces efficiently and alternate the functions by only updating the bare die/module. In this paper, the die-level functional substrates, the MorPACK modules, and a digital photo frame demo system are demonstrated and run with MorPACK platform to show how the academics/industries can prototype their circuits/system design with the MorPACK platform.