论文信息 - Integrated-circuit pressed-ceramic package antenna for the single-chip solution of a wireless transceiver.

Integrated-circuit pressed-ceramic package antenna for the single-chip solution of a wireless transceiver.

A novel integrated-circuit pressed-ceramic package antenna is proposed for the single-chip solution of a wireless transceiver. The antenna printed on a dual-in-line package is studied experimentally at 2.4 GHz. The results show that the antenna has achieved a bandwidth of 15.7% and a gain of −2.0 dBi. © 2001 John Wiley & Sons, Inc. Microwave Opt Technol Lett 30: 330–332, 2001.

Y. P. Zhang | Manh-Anh Do

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