Fracture of Copper/Alumina Interfaces: the Role of Microstructure and Chemistry
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[1] R. M. Cannon,et al. Interface formation and strength in ceramic-metal systems , 1994 .
[2] K. Trumble,et al. Role of Oxygen in Microstructure Development at Solid-State Diffusion-Bonded Cu/α-Al2O3 Interfaces , 1994 .
[3] A. Evans,et al. The fracture resistance of metal-ceramic interfaces , 1993 .
[4] K. Trumble,et al. Fracture at Cu/sapphire interfaces , 1992 .
[5] Y. Yoshino,et al. Structure and Bond Strength of a Copper–Alumina Interface , 1992 .
[6] Sung Tae Kim,et al. Interfacial reaction product and its effect on the strength of copper to alumina eutectic bonding , 1992 .
[7] Jun-Min Liu,et al. Theory and experiments on irregular eutectic growth: investigation on Al-Si eutectic growth , 1992 .
[8] Ivar E. Reimanis,et al. The fracture resistance of a model metal/ceramic interface , 1991 .
[9] Y. Yoshino. Role of oxygen in bonding copper to alumina , 1989 .
[10] A. Evans,et al. The strength and fracture of alumina bonded with aluminum alloys , 1989 .
[11] A. Evans,et al. A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces , 1989 .
[12] Anthony G. Evans,et al. Effects of non-planarity on the mixed mode fracture resistance of bimaterial interfaces , 1989 .
[13] D. Tréheux,et al. Study of copper-alumina bonding , 1986 .
[14] T. Ishiguro,et al. High temperature structural investigation of the delafossite type compound CuAlO2 , 1982 .
[15] N. Ishizawa,et al. A structural investigation of α‐Al2O3 at 2170 K , 1980 .
[16] Y.S. Sun,et al. A new hybrid power technique utilizing a direct Copper to ceramic bond , 1976, IEEE Transactions on Electron Devices.
[17] C. Neugebauer,et al. The Direct Bonding of Metals to Ceramics by the Gas‐Metal Eutectic Method , 1975 .
[18] R. Davidge,et al. The strength of two-phase ceramic/glass materials , 1968 .
[19] Tadasu Suzuki. X-Ray Study on the Binding Properties of Cu 2 O and Ag 2 O Crystals , 1960 .