Next Generation Ceramic Substrate Fabricated at Room Temperature

[1]  J. Ryu,et al.  Fabrication and characterization of aluminum nitride thick film coated on aluminum substrate for heat dissipation , 2016 .

[2]  J. Ryu,et al.  Microstructure and electrochemical properties of graphite and C-coated LiFePO4 films fabricated by aerosol deposition method for Li ion battery , 2015 .

[3]  D. K. Kim,et al.  Processing and Characterization of Aluminum Nitride Ceramics for High Thermal Conductivity , 2014 .

[4]  Li Shi,et al.  Emerging challenges and materials for thermal management of electronics , 2014 .

[5]  Young Joon Yoon,et al.  Enhanced heat transfer by room temperature deposition of AlN film on aluminum for a light emitting diode package , 2013 .

[6]  D. Faoite,et al.  A review of the processing, composition, and temperature-dependent mechanical and thermal properties of dielectric technical ceramics , 2012, Journal of Materials Science.

[7]  Hyoun‐Ee Kim,et al.  Dense Nanostructured Hydroxyapatite Coating on Titanium by Aerosol Deposition , 2009 .

[8]  Doh-Yeon Kim,et al.  Fabrication of Lead Zirconate Titanate Thick Films Using a Powder Containing Organic Residue , 2008 .

[9]  3 Method , 2008, Silencing the Demon’s Advocate.

[10]  Jun Akedo,et al.  Aerosol Deposition of Ceramic Thick Films at Room Temperature: Densification Mechanism of Ceramic Layers , 2006 .

[11]  Dongsik Kim,et al.  Thermal Conductivity of AlN and SiC Thin Films , 2006 .

[12]  Chunling Zhu,et al.  Pulsed photothermal reflectance measurement of the thermal conductivity of sputtered aluminum nitride thin films , 2004 .

[13]  B. Lenoir,et al.  Optical and thermal characterization of AlN thin films deposited by pulsed laser deposition , 2002 .

[14]  Subhash Shinde,et al.  High Thermal Conductivity Materials , 2001 .

[15]  Gregory W. Auner,et al.  Microstructure and thermal conductivity of epitaxial AlN thin films , 1994 .

[16]  D. Cahill Thermal conductivity measurement from 30 to 750 K: the 3ω method , 1990 .

[17]  M. Cain Dielectric Breakdown in Dielectrics and Ferroelectric Ceramics , 2014 .

[18]  Xingcun Colin Tong,et al.  Development and Application of Advanced Thermal Management Materials , 2011 .

[19]  Dong-won Lee,et al.  Factors affecting surface roughness of Al 2 O 3 films deposited on Cu substrates by an aerosol deposition method , 2010 .

[20]  Robert O. Pohl,et al.  The intrinsic thermal conductivity of AIN , 1987 .