From SOI to Abstract Electric-Thermal-1D Multiscale Modeling for First Order Thermal Effects

Self-heating occurs in integrated circuits, specially for SOI-based devices. Naturally, the heat distribution affects the circuit’s functionality. For reliable designs in SOI-chip technology, and other applications, the thermal aspects have to be addressed. Therefore we develop a model, which is based on distributed 1D and lumped 0D elements, and takes into account that heat is stored and slowly conducted between elements. The emerging coupled multiscale system of heat evolution and electric network consists of parabolic partial-differential (thermal part) and differential-algebraic equations (electric network part). For the thermal model, we verify properties as positivity and strict passivity. Since time scales differ largely, the coupled problem exhibits multirate potential.

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