Study on Packaging and Driver Integration with GaN Switches for Fast Switching

This paper gives a short overview of opportunities coming with new technologies in packaging and driver integration offered by high voltage GaN power semiconductors. Understanding of the GaN features inspires to ideas for possible monolithic integrations and solutions on semiconductor level. Understanding of assembly parasitics influencing fast switching allows designing of an ideal GaN package presented in this paper and suited to generate the most benefit from the semiconductor.