Interfacial toughening of solution processed Ag nanoparticle thin films by organic residuals

Reliable integration of solution processed nanoparticle thin films for next generation low-cost flexible electronics is limited by mechanical damage in the form of delamination and cracking of the films, which has not been investigated quantitatively or systematically. Here, we directly measured the interfacial fracture energy of silver nanoparticle thin films by using double cantilever beam fracture mechanics testing. It was demonstrated that the thermal annealing temperature and period affect the interfacial fracture energy. Also it was found that the interfacial fracture resistance can be maximized with optimized annealing conditions by the formation of organic residual bridges during the annealing process.

[1]  A. Wu,et al.  Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging , 2012 .

[2]  B. Cho,et al.  Direct measurement of adhesion energy of monolayer graphene as-grown on copper and its application to renewable transfer process. , 2012, Nano letters.

[3]  A. Manuilskiy,et al.  Evaluation of Coatings Applied to Flexible Substrates to Enhance Quality of Ink Jet Printed Silver Nano-Particle Structures , 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[4]  J. Lewis,et al.  Pen‐on‐Paper Flexible Electronics , 2011, Advanced materials.

[5]  Young-Min Choi,et al.  Combined Role of Well-Dispersed Aqueous Ag Ink and the Molecular Adhesive Layer in Inkjet Printing the Narrow and Highly Conductive Ag Features on a Glass Substrate , 2010 .

[6]  A. Alastalo,et al.  Substrate-facilitated nanoparticle sintering and component interconnection procedure , 2010, Nanotechnology.

[7]  Young-Min Choi,et al.  Preparation of aqueous Ag Ink with long-term dispersion stability and its inkjet printing for fabricating conductive tracks on a polyimide film , 2010 .

[8]  Chunxiang Xu,et al.  Low temperature sintering of Ag nanoparticles for flexible electronics packaging , 2010 .

[9]  C. Innocenti,et al.  Additive nanoscale embedding of functional nanoparticles on silicon surface. , 2010, Nanoscale.

[10]  D. Baldwin,et al.  Adhesion mechanisms of nanoparticle silver to substrate materials: identification , 2010, Nanotechnology.

[11]  D. Baldwin,et al.  Analysis of Adhesion and Fracture Energy of Nano-Particle Silver in Electronics Packaging Applications , 2010, IEEE Transactions on Advanced Packaging.

[12]  V. Subramanian,et al.  Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology , 2009 .

[13]  F. Biscarini,et al.  Nanopatterning Soluble Multifunctional Materials by Unconventional Wet Lithography , 2009 .

[14]  W. Stark,et al.  Graphene-stabilized copper nanoparticles as an air-stable substitute for silver and gold in low-cost ink-jet printable electronics , 2008, Nanotechnology.

[15]  R. Dauskardt,et al.  Tuning depth profiles of organosilicate films with ultraviolet curing , 2008 .

[16]  Dong-Soo Kim,et al.  Fabrication of Printed Organic Thin-Film Transistors Using Roll Printing , 2008 .

[17]  Inyoung Kim,et al.  Effect of Microstructural Development on Mechanical and Electrical Properties of Inkjet-Printed Ag Films , 2008 .

[18]  M. Aegerter,et al.  Direct gravure printing of indium tin oxide nanoparticle patterns on polymer foils , 2008 .

[19]  M. Timko,et al.  Multiple-length-scale patterning of magnetic nanoparticles by stamp assisted deposition , 2008, Journal of physics. Condensed matter : an Institute of Physics journal.

[20]  Young‐Chang Joo,et al.  Characteristics of microstructure and electrical resistivity of inkjet-printed nanoparticle silver films annealed under ambient air , 2008 .

[21]  J. Shyue,et al.  X-ray photoelectron spectrometry depth profiling of organic thin films using C60 sputtering. , 2008, Analytical chemistry.

[22]  T. Reda,et al.  Nanoparticle films as sensitive strain gauges , 2007 .

[23]  I. Park,et al.  Nanoscale Patterning and Electronics on Flexible Substrate by Direct Nanoimprinting of Metallic Nanoparticles , 2007 .

[24]  H. Jaeger,et al.  Elastic membranes of close-packed nanoparticle arrays. , 2007, Nature materials.

[25]  Kuo-Ning Chiang,et al.  Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure , 2007, Microelectron. Reliab..

[26]  I. Park,et al.  Direct nanoimprinting of metal nanoparticles for nanoscale electronics fabrication. , 2007, Nano letters.

[27]  G. Ramanath,et al.  Annealing-induced interfacial toughening using a molecular nanolayer , 2007, Nature.

[28]  R. Street,et al.  Mechanical characterization of solution-derived nanoparticle silver ink thin films , 2007 .

[29]  R. Dauskardt,et al.  Toughening of nanoporous glasses using porogen residuals , 2004, Nature materials.

[30]  N. Sanada,et al.  Extremely low sputtering degradation of polytetrafluoroethylene by C60 ion beam applied in XPS analysis , 2004 .

[31]  F. Biscarini,et al.  Nanostructuring Conjugated Materials by Lithographically Controlled Wetting , 2003 .

[32]  Jin Yu,et al.  Analysis of the T-peel strength in a Cu/Cr/Polyimide system , 2002 .

[33]  Robert J. Hohlfelder,et al.  Adhesion of benzocyclobutene-passivated silicon in epoxy layered structures , 2001 .

[34]  Huajian Gao,et al.  Plasticity contributions to interface adhesion in thin-film interconnect structures , 2000 .

[35]  L. Nicolais,et al.  Preparation and characterization of nano-sized Ag/PVP composites for optical applications , 2000 .

[36]  Michael Lane,et al.  Adhesion and debonding of multi-layer thin film structures , 1998 .

[37]  Zhigang Suo,et al.  Remarks on Crack-Bridging Concepts , 1992 .

[38]  P. Couturier.  Japan , 1988, The Lancet.

[39]  P. Buffat,et al.  Size effect on the melting temperature of gold particles , 1976 .

[40]  M. F. Kanninen,et al.  An augmented double cantilever beam model for studying crack propagation and arrest , 1973, International Journal of Fracture.

[41]  S. G. Zybtsev,et al.  High-frequency, ‘quantum’ and electromechanical effects in quasi-one-dimensional charge density wave conductors , 2013 .

[42]  Young‐Chang Joo,et al.  Improved mechanical performance of solution-processed MWCNT/Ag nanoparticle composite films with oxygen-pressure-controlled annealing , 2012 .

[43]  D. Gethin,et al.  Patterning of micro-scale conductive networks using reel-to-reel flexographic printing , 2010 .