论文信息 - Investigations of silicon wafer grinding using finite element analysis

Investigations of silicon wafer grinding using finite element analysis

Silicon wafers are used as substrates to build more than 90% of integrated circuits. One of the manufacturing processes for silicon wafers is grinding. This paper reports the investigations of silicon wafer grinding using Finite Element Analysis (FEA). FEA models are first used to study the effects of process parameters on waviness reduction in the grinding of wire-sawn wafers on a rigid chuck. Then, soft-pad grinding of wire-sawn wafers is modelled using FEA to study the effects of pad properties on waviness reduction. Finally, FEA is used to study the elastic deformation of the grinding wheel, providing an explanation for the central dimples on ground wafers.

Z. J. Pei | J. H. Liu | G. R. Fisher

[1] Wangping Sun,et al. Fine grinding of silicon wafers: effects of chuck shape on grinding marks , 2005 .

[2] Zhijian Pei,et al. Waviness removal in grinding of wire-sawn silicon wafers: 3D finite element analysis with designed experiments , 2004 .

[3] Zhijian Pei,et al. Finite element analysis for grinding of wire-sawn silicon wafers: a designed experiment , 2003 .

[4] Zhijian Pei,et al. Finite element analysis for grinding and lapping of wire-sawn silicon wafers , 2002 .

[5] Zhijian Pei,et al. Fine grinding of silicon wafers , 2001 .

[6] Zhijian Pei,et al. A grinding-based manufacturing method for silicon wafers: generation mechanisms of central dimples on ground wafers , 2006 .