论文信息 - Fabrication and packaging tolerances of a free-space micro-optical intra-MCM interconnection module: From raytracing model to experimental evidence

Fabrication and packaging tolerances of a free-space micro-optical intra-MCM interconnection module: From raytracing model to experimental evidence

We report on the design of a micro-optical pathway block to interconnect 2-D Photonic-VLSI chips. We model the impact of manufacturing and assembly errors with a tolerance analysis and verify our conclusions experimentally.

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