We present an analysis of gate length scaling of WS2 transistors fully fabricated in a 300mm pilot line. Despite low channel mobility, $I_{\max}=100\mu \mathrm{A}/\mu \mathrm{m}$ is enabled by low side contact resistance $R_{\mathrm{c}}=1.3\pm 1.0\mathrm{k}\Omega-\mu \mathrm{m}$ at $n=3\times 10^{13}\text{cm}^{-2}$. Hysteresis of 5m V/V at moderate electric fields is demonstrated. High single-device yield and low variability is achieved, and it is established that $I_{\text{on}}$ correlates mainly with mobility and less with SS and $V_{\mathrm{t}}$. We demonstrate that switch-off can still be achieved with extremely scaled $L_{\mathrm{g}}=2\text{nm}$, but significant short-gate effects occur due to thick CET and unoptimized device configuration. We show better short-gate control with connected dual gate configuration. TCAD simulations identify the main performance bottlenecks and a path towards improved device performance over Silicon FETs.