Drain-engineered hot-electron-resistant device structures: a review
暂无分享,去创建一个
[1] D. L. Critchlow,et al. Fabrication of high-performance LDDFET's with Oxide sidewall-spacer technology , 1982 .
[2] S. Ogura,et al. Halo doping effects in submicron DI-LDD device design , 1985, 1985 International Electron Devices Meeting.
[3] S. L. Miller. Ionization Rates for Holes and Electrons in Silicon , 1957 .
[4] S. Ikeda,et al. Hot carrier degradation modes and optimization of LDD MOSFETs , 1984, 1984 International Electron Devices Meeting.
[5] T. A. DeMassa,et al. Hot-electron resistance device processing and design: a review , 1989 .
[6] D. Hoyniak,et al. Characterization of As-P double diffused drain structure , 1984, 1984 International Electron Devices Meeting.
[7] D.P. Kennedy,et al. Avalanche breakdown characteristics of a diffused P-N junction , 1962, IRE Transactions on Electron Devices.
[8] Tetsuya Iizuka,et al. Hot-carrier suppressed VLSI with submicron geometry , 1985, 1985 IEEE International Solid-State Circuits Conference. Digest of Technical Papers.
[9] S. Ogura,et al. Design and characteristics of the lightly doped drain-source (LDD) insulated gate field-effect transistor , 1980 .
[10] W.W. Walker,et al. Elimination of hot electron gate current by the lightly doped drain-source structure , 1981, 1981 International Electron Devices Meeting.
[11] K. Kanzaki,et al. Relief of hot carrier constraint on submicron CMOS devices by use of a buried channel structure , 1985, 1985 International Electron Devices Meeting.
[12] Reliability and performance of submicron LDD NMOSFET's with buried As n-impurity profiles , 1985, 1985 International Electron Devices Meeting.
[13] Toru Kaga,et al. Effects of lightly doped drain structure with optimum ion dose on p-channel MOSFETs , 1988 .
[14] S. Bampi,et al. Modified LDD device structures for VLSI , 1985, 1985 International Electron Devices Meeting.
[15] T. Horiuchi,et al. Comparison of drain structures in n-channel MOSFET's , 1986, IEEE Transactions on Electron Devices.
[16] Shojiro Asai,et al. Submicron MOSFET Structure for Minimizing Channel Hot-Electron Injection , 1981, 1981 Symposium on VLSI Technology. Digest of Technical Papers.
[17] J. Pimbley,et al. Buried and graded/buried LDD structures for improved hot-electron reliability , 1986, IEEE Electron Device Letters.
[18] F. Hsu,et al. Structure-enhanced MOSFET degradation due to hot-electron injection , 1984, IEEE Electron Device Letters.
[19] S. Bampi,et al. A modified lightly doped drain structure for VLSI MOSFET's , 1986, IEEE Transactions on Electron Devices.
[20] K. Kanzaki,et al. Mechanism of hot electron induced degradation in LDD NMOS-FET , 1984, 1984 International Electron Devices Meeting.